Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
Verified Supplier
14 Years
Since 2012
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15''HD LCD Monitor Mobile Phone BGA Rework Station with 5 Modes Stepping Motor and CCD Color Optical Alignment System

Price Negotiable
Price: Negotiable
MOQ: 1 set
Delivery Time: 7~9 work days
Brand: HSTECH
Product Description
15" HD LCD Monitor Mobile Phone BGA Rework Station
Professional-grade BGA rework station featuring 5 work modes, stepping motor technology, and CCD color optical alignment system for precision mobile phone motherboard repair.
Key Features
5 versatile work modes for flexible operation
15" HD LCD monitor for clear visual feedback
7" HD color touch screen interface
Precision stepping motor control
CCD color optical alignment system
Temperature accuracy within ±1℃
Mounting precision within ±0.01mm
99%+ repair success rate
Independent research and development of single-chip control
Technical Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Electric Material Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Locating Method V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions L450mm × W470mm × H670mm
PCB Size Range Max 140mm × 160mm, Min 5mm × 5mm
BGA Size Range Max 50mm × 50mm, Min 1mm × 1mm
Applicable PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Mount Chip Weight 150g
Working Modes Five: Semi-auto/Manual/Remove/Mount/Weld
Application Chips / phone motherboard repair
Product Images
5 Modes Stepping Motor CCD Color Align System Mobile Phone BGA Rework Station front view 5 Modes Stepping Motor CCD Color Align System Mobile Phone BGA Rework Station operational view
Performance Highlights
Exceptional ±0.01mm mounting precision for delicate component placement
Advanced temperature control system maintains ±1℃ accuracy
Proven 99%+ success rate in mobile phone motherboard repair applications

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Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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