Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
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14 Years
Since 2012
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PEEK 30CC PUR Jetting Valve with 0~2.0Kpa Pressure Control for SMT/FPC/PCB Assembly Applications

Price Negotiable
Price: Negotiable
MOQ: 1 PC
Delivery Time: 3-5 work days
Brand: HSTECH
Product Description
PEEK 30CC PUR Jetting Valve for SMT/FPC/PCB Assembly
High-precision piezoelectric jetting valve designed for precision dispensing applications with 0~2.0Kpa syringe pressure control.
Working Principle & Control System
PUR Jetting Valve Components
  • Drum heating module with temperature control for initial gel heating
  • Pressurized cap module for sealing and pressure regulation
  • Nozzle heating module for maintaining optimal gel temperature
  • Flow path module for customizable dispensing configurations
  • Valve body module with heat dissipation for noise reduction
Nozzle Options
  • Diameter range: 40µm to 500µm
  • Types: Flat jet, needle type, and extension type
  • Regular ultrasonic cleaning required (avoid organic solvents on seals)
Controller Features
  • Touch screen with graphical control interface
  • MES communication support
  • Two-stage nozzle heating system
  • Temperature maintenance for optimal gel performance
Technical Specifications
Parameter HS-PF-PUR30CC HS-PF-PUR300CC-A/B
Dimensions (L×W×H) 116mm × 96mm × 218mm 116mm × 96mm × 218mm
Weight Approximately 1.2kg Approximately 1.5kg
Heat Insulation Material PEEK PEEK
Temperature Measurement PT100 PT100
Barrel Heating Temperature ≤150℃ ≤160℃
Syringe Air Pressure 0~2.0Kpa 0~2.0Kpa
Dispensing Precision >98% >98%
Minimum Glue Line Width 0.35mm 0.5mm
Viscosity Range 1~100,000Cps 1~100,000Cps
Jet Speed 200 points/sec 200 points/sec
Valve Material Super Hard Stainless Steel Super Hard Stainless Steel
Nozzle Material Tungsten Steel Tungsten Steel
Heating Voltage 220V 220V
Seat Heating Temperature ≤250℃ ≤250℃
Valve Air Pressure 6.5~7.0Kpa 6.0~7.0Kpa
Glue Dispensing Volume 0.3nl 0.3nl
Maximum Dispensing Diameter 0.3mm 0.4mm
Power Source Dry compressed gas Dry compressed gas
Applicable Liquids PUR hot melt adhesive, silicone products, epoxy resin Most hot melt adhesives, silicone, red glue, epoxy resin, black glue
Key Advantages
Versatile Compatibility
Supports 30cc, 100cc, and 300cc hot melt adhesive volumes
Modular Design
Easy part replacement and simple debugging for wide process applications
High Precision
Spray volume accuracy to 0.3nL with 98% consistency
Fine Dispensing
Minimum 0.17mm line width and 0.15mm spot diameters
Universal Integration
Compatible with any motion platform on the market
Application Fields
SMT/FPC/PCB assembly, flat panel display assembly, semiconductor packaging, LED industry, medical equipment industry, non-marking lingerie industry.

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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