High Precision K-sensor BGA Rework Station with 7' HD Color Touch Screen and ±0.01mm Mounting Accuracy
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
High Precision K-sensor Mobile Phone BGA Reballing Station
Advanced BGA rework station featuring a 7-inch HD color touch screen and precision K-sensor technology for professional mobile phone motherboard repair.
Key Features
- 5 modes stepping motor CCD color align system
- High precision K-sensor with closed loop control
- 7-inch HD color touch screen interface
- Multiple working modes: Semi-auto/Manual/Remove/Mount/Weld
- Laser centering and positioning system
Technical Specifications
| Model | HS-700 |
|---|---|
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W (Max), bottom heater 1200W (Max) |
| Temperature Control | High precision K-sensor + closed loop control (±1℃ precision) |
| PCB Size Range | Max 140mm×160mm, Min 5mm×5mm |
| BGA Size Range | Max 50mm×50mm, Min 1mm×1mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
BGA Repair Process
- Desoldering: Separate the BGA chip from motherboard
- Pad Cleaning: Prepare the surface for new component
- Reballing: Apply new solder balls or replace BGA chip
- Alignment: Precise positioning using laser and optical systems
- Soldering: Secure new BGA chip in place
Applications
Ideal for repairing chips, mobile phone motherboards, and other electronic components requiring precision BGA rework.
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin