Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
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China 5 Modes Stepping Motor CCD Color Align System BGA Rework Station with ±0.01mm Mounting Accuracy for Mobile Phone BGA Chip Repair for sale

5 Modes Stepping Motor CCD Color Align System BGA Rework Station with ±0.01mm Mounting Accuracy for Mobile Phone BGA Chip Repair

Price Negotiable
Price: Negotiable
MOQ: 1 set
Delivery Time: 7~9 work days
Brand: HSTECH
Product Description
5 Modes Stepping Motor CCD Color Align System Mobile Phone BGA Rework Station
High precision BGA rework station featuring advanced CCD color alignment system with five operational modes for professional mobile phone motherboard repair.
Technical Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Electrical Components Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Positioning Method V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions 450mm × 470mm × 670mm (L×W×H)
PCB Size Range Max 140mm×160mm, Min 5mm×5mm
BGA Size Range Max 50mm×50mm, Min 1mm×1mm
PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Maximum Chip Weight 150g
Working Modes Five: Semi-auto/Manual/Remove/Mount/Weld
Application Chips / phone motherboard repair
Key Features
  • BGA optical alignment system for fast and accurate positioning
  • Import drive motor, PLC intelligent temperature controller, true color touch screen with external high-definition display
  • Precision temperature control with K-type thermocouple closed-loop system (±1℃ accuracy)
  • Versatile positioning with V-slot PCB bracket featuring X, Y adjustment and universal fixture configuration
  • User-friendly operation with intuitive controls
  • Compatible with all models of mobile phones for comprehensive repair capabilities
Packaging Details
HS-700 BGA Rework Station packaging and components Mobile phone BGA rework station in operation Technical diagram of BGA rework station components
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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