Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
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14 Years
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China High Precision K-Sensor BGA Rework Station with ±0.01mm Mounting Accuracy and ±1℃ Temperature Accuracy for Mobile Phone Chip Repair for sale

High Precision K-Sensor BGA Rework Station with ±0.01mm Mounting Accuracy and ±1℃ Temperature Accuracy for Mobile Phone Chip Repair

Price Negotiable
Price: Negotiable
MOQ: 1 set
Delivery Time: 7~9 work days
Brand: HSTECH
Product Description
High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair
5 Modes Stepping Motor CCD Color Align System
Professional mobile phone BGA rework station featuring advanced temperature control and precision alignment for chip repair applications.
Technical Specifications
Model HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total Power 2600W
Heater Power Top heater 1200W (Max), bottom heater 1200W (Max)
Electric Material Driving motor + smart temperature controller + color touch screen
Temperature Control High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision)
Sensor 1 piece
Locating System V shape PCB support + external universal fixture + laser light for centering and positioning
Overall Dimensions L450mm × W470mm × H670mm
PCB Size Range Max 140mm×160mm / Min 5mm×5mm
BGA Size Range Max 50mm×50mm / Min 1mm×1mm
PCB Thickness 0.3 - 5mm
Mounting Accuracy ±0.01mm
Machine Weight 30KG
Mount Chip Weight 150g
Working Modes Five: Semi-auto / Manual / Remove / Mount / Weld
Applications Chips / phone motherboard repair
Key Features
  • Dual heating zones with ±1℃ temperature precision control, simultaneous top and bottom heating with 8 independent temperature control segments
  • Hot air district heating for BGA and PCB simultaneously, with flexible combination of upper and lower heating elements
  • High precision K-type thermocouple closed-loop control with PID parameter self-setting system
  • Real-time temperature curve display with analysis function and multi-group user data storage
  • External measurement interface for precise temperature testing and on-screen curve analysis and correction
Product Images
HS-700 BGA Rework Station front view and control panel HS-700 BGA Rework Station side view showing heating elements HS-700 BGA Rework Station technical diagram and specifications
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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