High Precision BGA Rework Station with CCD Color Optical Alignment System and ±0.01mm Mounting Accuracy for Mobile Phone BGA Chip Repair
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
High Precision CCD Color Align System with Stepping Motor for Mobile Phone BGA Rework
Advanced 5-mode stepping motor CCD color alignment system designed for precision mobile phone BGA rework operations with exceptional accuracy and reliability.
Technical Specifications
| Specification | Details |
|---|---|
| Model | HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W (Max), bottom heater 1200W (Max) |
| Electrical Components | Driving motor + smart temperature controller + color touch screen |
| Temperature Control | High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision) |
| Sensor | 1 piece |
| Positioning Method | V-shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall Dimensions | L450mm × W470mm × H670mm |
| PCB Size | Max 140mm × 160mm, Min 5mm × 5mm |
| BGA Size | Max 50mm × 50mm, Min 1mm × 1mm |
| Applicable PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
| Mount Chip Weight | 150g |
| Working Modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Application | Chips / phone motherboard repair |
Key Features
- 5 versatile work modes for flexible operation
- 15-inch HD LCD monitor for clear visualization
- 7-inch HD color touch screen interface
- Precision stepping motor control
- Advanced CCD color optical alignment system
- Temperature accuracy within ±1℃
- Mounting precision within ±0.01mm
- Exceptional repair success rate: 99%+
- Independently developed single-chip control system
Main Configuration
- Five working modes for comprehensive functionality
- Independently developed microcontroller control
- High-precision stepping motor
- 7.2-inch true color touch screen display
- Infrared laser lamp positioning system
- Optical alignment for precise installation
System Advantages
- Automatic suction and installation capabilities
- Built-in vacuum pump rotates 90° for precise nozzle adjustment
- Integrated pressure testing device prevents PCB and BGA damage
- Multiple vacuum suction cups with various nozzles for different chip types
Product Images
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin