7''HD color Touch Scree Mobile Phone BGA Rework Station with Stepping Motor
15''HD LCD monitor Mobile Phone BGA Rework Station with 5 Modes Stepping Motor CCD Color
Introduction:
A Mobile Phone BGA Rework Station is a specialized piece of equipment designed for repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable devices.
Features:
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
Specification:
| Mobile Phone BGA Rework Station | Model:HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total power | 2600W |
| Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electric material | Driving motor + smart temp. controller + color touch screen |
| Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
| Sensor | 1pcs |
| Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall dimension | L450mm*W470mm*H670mm |
| PCB size | Max 140mm*160mm Min 5mm*5mm |
| BGA size | Max 50mm*50mm Min 1mm*1mm |
| Applicable PCB thickness | 0.3 - 5mm |
| Mounting accuracy | ±0.01mm |
| Weight of machine | 30KG |
| Mount chip weight | 150g |
| Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage Repair | chips / phone motherboard etc |
Applications
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Mobile Phone Repair:
- Primarily used for repairing smartphones that have BGA components, such as processors, memory chips, and graphics chips.
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Consumer Electronics:
- Applicable in the repair of other consumer electronics that utilize BGA technology, including tablets, laptops, and gaming consoles.
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Prototyping and Development:
- Used in research and development environments for prototyping new circuit designs that incorporate BGA packages.
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Quality Control:
- Employed in quality assurance processes to rework defective components before final assembly.
Advantages
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Enhanced Repair Efficiency:
- Speeds up the rework process, allowing technicians to handle multiple repairs quickly and efficiently.
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Cost-Effective:
- Extends the life of devices by enabling the repair of expensive BGA components rather than replacing the entire board.
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Improved Precision:
- Advanced technology allows for high-precision repairs, reducing the risk of damage to adjacent components.
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Flexibility:
- Suitable for a wide range of BGA sizes and types, making it versatile for different repair tasks.
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User Training and Support:
- Many manufacturers provide training and support, helping technicians to effectively use the equipment and improve their repair skills.
Get in Touch
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