Double Rocker Control 4-6bar Air Pressure BGA Rework Station with ±0.01mm Mounting Accuracy for Electronic Assembly
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
Double Rocker Control 4-6bar BGA Rework Station for Electronic Assembly
A specialized BGA Rework Station designed for the repair and rework of Ball Grid Array (BGA) components on printed circuit boards (PCBs). This essential equipment enables technicians to replace or repair BGAs without damaging the PCB or surrounding components in electronics manufacturing and repair environments.
Key Features
- Integrated hot air head and mounting head design with automatic soldering and desoldering functions
- Upper heaters utilize hot air system for faster heating, even temperature distribution, and rapid cooling (temperature range: 50-80°C)
- Three independent heaters with synchronized automatic movement of upper and lower heaters
- High-precision slider ensures accurate BGA and PCB mounting alignment
- Premium German-imported heating materials in bottom preheating table
- Integrated movement of preheating table, clamping device, and cooling system in X-axis
- Motor-controlled automatic X and Y axis movement for faster alignment
- Double rocker control for camera and heating platforms ensuring precision alignment
- Built-in 360° rotating vacuum pump with fine-adjusting mounting suction nozzle
- Automatic BGA pickup and mounting height detection with pressure control
- High-resolution color optical vision system with split vision, zoom, and auto-focus capabilities
- 10-segment temperature control with multiple temperature profile storage
- Multiple alloy nozzle sizes with easy replacement and full-angle positioning
- Five thermocouple ports for real-time multi-point temperature monitoring
- Solid operation display for reliable temperature control
Technical Specifications
| Model | HS-800 |
| Heater Power | Top heater 1200W (Max), bottom heater 1200W (Max) |
| Bottom Pre-Heating | IR 5000W |
| Temperature Control | K-type thermocouple, closed loop control |
| Locating Method | Outer or location hole |
| Overall Dimensions | L970mm × W700mm × H830mm |
| PCB Size | W650mm × D610mm |
| BGA Size Range | Max 80mm × 80mm, Min 1mm × 1mm |
| PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 140KG |
Applications
Suitable for mobile phones, hard drives, keyboards, electronic toys, computers, DVD players, plastics, electrical appliances, communication equipment, motors, tablets, notebook computers, digital cameras, remote controls, walkie-talkies, and various electronic processing applications.
Operational Benefits
- Precision and Accuracy: Enables accurate removal and placement of BGA components, minimizing PCB damage risk
- Cost-Effective Repairs: Extends PCB lifespan through repair capabilities, reducing replacement costs
- Enhanced Workflow: Streamlines repair processes for faster turnaround in production and repair environments
- Improved Quality Control: Ensures proper component soldering and alignment for enhanced product reliability
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin