High Precision BGA Rework Station with ±0.01mm Mounting Accuracy and CCD Color Optical Alignment System for Mobile Phone Repair
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
High Precision Stepping Motor CCD Color Align System for Mobile Phone BGA Reworking
This advanced BGA rework station features high precision optical alignment technology for mobile phone motherboard repair, utilizing a stepping motor and CCD color optical system to achieve exceptional mounting accuracy.
Product Overview
BGA rework stations are categorized into optical alignment and non-optical alignment systems. Optical alignment employs a split prism imaging module for precise component placement, while non-optical alignment relies on visual alignment with PCB board silkscreen markings.
Technical Specifications
| Model | HS-700 |
|---|---|
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W (Max), bottom heater 1200W (Max) |
| Electrical Components | Driving motor + smart temperature controller + color touch screen |
| Temperature Control | High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision) |
| Sensor | 1 piece |
| Positioning Method | V-shape PCB support + external universal fixture + laser centering and positioning |
| Overall Dimensions | L450mm × W470mm × H670mm |
| PCB Size Range | Max 140mm × 160mm, Min 5mm × 5mm |
| BGA Size Range | Max 50mm × 50mm, Min 1mm × 1mm |
| PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
| Maximum Chip Weight | 150g |
| Working Modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Application | Chips / phone motherboard repair |
Key Features
- 5 versatile work modes for flexible operation
- 15" HD LCD monitor for clear visual feedback
- 7" HD color touch screen for intuitive control
- Precision stepping motor for accurate positioning
- CCD color optical alignment system for superior accuracy
- Temperature accuracy within ±1℃
- Mounting precision within ±0.01mm
- Repair success rate: 99%+
- Independent research and development of single-chip control
The BGA Rework Workstation is specialized welding equipment designed for repairing BGA packages. Available in automatic and manual configurations, this intelligent equipment handles various BGA component sizes, significantly improving repair productivity and success rates while reducing operational costs.
Product Images
Manufacturer Information
Shenzhen Hansome Technology Co., Ltd (HSTECH) is a professional manufacturer of SMT board handling equipment including loaders, unloaders, buffers, and conveyors. As a high-tech enterprise with independent intellectual property rights, the company specializes in research, development, production, and sales of SMT/THT production line board handling equipment. Our experienced engineering team continuously updates products and technology according to market demands, pursuing automation and cost-effective solutions while offering OEM services to meet specific customer requirements.
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Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin