High Definition Touch Screen BGA Rework Station with ±0.01mm Mounting Accuracy and 2600W Total Power for Mobile Phone Repair
High-precision CCD color alignment system for PCB handling equipment designed for professional BGA chip rework applications.
BGA (Ball Grid Array) is a chip packaging technology where an array of solder balls on the substrate bottom serves as I/O connections to the printed circuit board. This packaging method enables digital devices to achieve smaller sizes, enhanced features, lower costs, and greater functionality. The BGA rework station is specialized equipment for repairing and replacing BGA chips.
| Specification | Details |
|---|---|
| Model | HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W(Max), bottom heater 1200W(Max) |
| Electrical Components | Driving motor + smart temperature controller + color touch screen |
| Temperature Control | High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision) |
| Sensor | 1 piece |
| Positioning Method | V-shape PCB support + external universal fixture + laser centering and positioning |
| Overall Dimensions | L450mm × W470mm × H670mm |
| PCB Size Range | Max 140mm×160mm, Min 5mm×5mm |
| BGA Size Range | Max 50mm×50mm, Min 1mm×1mm |
| PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
| Maximum Chip Weight | 150g |
| Working Modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Applications | Chips / phone motherboard etc. |
- 5 versatile work modes for flexible operation
- 15" HD LCD monitor for clear visual feedback
- 7" HD color touch screen for intuitive control
- Precision stepping motor for accurate positioning
- CCD color optical alignment system for perfect alignment
- Temperature accuracy within ±1℃ for precise thermal control
- Mounting precision within ±0.01mm for high-accuracy placement
- Repair success rate: 99%+ for reliable performance
- Independent research and development of single-chip control
Shenzhen Hansome Technology Co., Ltd (HSTECH) is a professional SMT board handling equipment manufacturer specializing in loaders, unloaders, buffers, conveyors, and related equipment. As a high-tech enterprise with independent intellectual property rights, the company focuses on research, development, production, and sales of SMT/THT production line board handling equipment.
Our experienced engineering team continuously updates products and technology according to market demands, pursuing automation and cost-effective solutions. We also provide OEM services based on customer requirements.
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