Independent 3 Heating Zones BGA Rework Station PCB Handling Equipment With SMEMA Signal

Independent 3 Heating Zones BGA Rework Station PCB Handling Equipment With SMEMA Signal

Introduce

The BGA rework station is a professional equipment used to repair BGA components. It is often used in the SMT industry. Next, we will introduce the basic principles of the BGA rework station and analyze the key factors to improve the BGA rework rate.

The BGA rework station is a device for reheating and welding poorly soldered BGAs. It cannot repair the factory quality problems of the BGA components themselves. However, according to the current level of technology, the probability of BGA components having problems before leaving the factory is very low. If there is a problem, it will only be poor welding caused by temperature at the SMT process end and the back end, such as empty welding, false welding, empty welding, tin connection and other welding problems. However, many individuals also use it when repairing laptops, mobile phones, XBOX, desktop motherboards, etc.

Features

1.Repair Success Rate:More Than 99%

2.Using The Industrial Touch Screen

3.Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat. (temperature accuracy ± 2℃)

4.With CE Certification

BGA rework station classification

Classified by automation level

BGA rework stations can be divided into three categories according to their functions, namely: purely manual BGA rework stations, semi-automatic BGA rework stations, and fully automatic BGA rework stations; the selections corresponding to different needs are also different. Generally, manual BGA rework stations and semi-automatic rework stations are suitable for user groups who are not relatively advanced in rework processes. First of all, the fully automatic BGA rework station is simple to operate, with almost no requirements on the operator, and one-button operation. Secondly, the success rate of repair is higher. More powerful functions.

Divided by function

According to functions, BGA rework stations can be divided into two categories: optical alignment and non-optical alignment. Optical alignment uses split prism imaging through the optical module; non-optical alignment uses the naked eye to align the BGA according to the silk screen lines and points of the PCB board to achieve alignment repair. Intelligent operating equipment for visual alignment, welding, and disassembly of BGA originals of different sizes can effectively improve the rework rate, productivity, and greatly reduce costs.

​Specification