Customizable Glue Mixing Ratio AB Glue Dispensing Machine with ±0.02mm Repeat Accuracy and 300*300*100mm Working Range
Price:
Negotiable
MOQ:
1 pc
Delivery Time:
5~7 work days
Brand:
HSTECH
Product Description
Customizable Glue Mixing Ratio Glue Dispensing Machine for Wall Sphere
Machine Features
- Convenient Operation: Equipped with manual programming for intuitive operation and quick mastery of skills
- Diversified Trajectories: Supports continuous tween function for points, lines, surfaces, arcs, circles, and irregular curves
- Adjustable Parameters: Flexible programming control over gluing amount, speed, dispensing time, and stopping time
- Stable & Reliable: Special dispensing controller ensures clean glue with no residue and prevents leakage
- Strong Adaptability: Capable of dispensing on interior, exterior walls, facades, gaps, and spherical surfaces
- Flexible Configuration: Customizable with fixtures, glue guns, controllers, and heating temperature control devices
Technical Specifications
| ITEM | SPEC |
|---|---|
| Glue Mixing Ratio | 1:1-10:1/Customizable |
| Dispensing Speed | 10-150g/5s (based on 1:1 glue proportion) |
| Dispensing Precision | Glue Amount ±1%, Glue Proportion ±1% |
| X/Y/Z Working Range | 300*300*100mm (Z axis can be rotated) |
| XYZ Speed | Max 300mm/s |
| Drive System | Stepping Motor + Timing Belt |
| Repeatability | ±0.02mm |
| Pattern | Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation |
| Potting Precision | Amount ±1%, Ratio: ±1% |
| Operation Method | Auto |
| Programming | Teach Pendant |
| Control | Board card |
| Leak-proof Function | Valve with Vacuum Device |
| Weight | 65kg |
| Dimension (L*W*H) | 716*585*645mm |
| Power Supply | 220V 50-60Hz 350W |
Applications
- Sensors, relays, power adapters, electronic toys, and sounders
- Electronic components, household appliances, and electric vehicle controllers
- Computer digital products, arts and crafts, mobile phone boards, and coil products
- Key products, battery boxes, and speaker point bonding
- Speaker packaging and dispensing, optical semiconductor packaging
- Mobile phone battery and notebook battery packaging
- PCB board bonding, COB, IC, PDA, and LCD packaging
- IC packaging, IC bonding, chassis bonding, and optical device processing
- Hardware parts packaging coating, quantitative liquid filling, and chip bonding
- Automotive mechanical parts coating and mechanical sealing
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin