Smart Temperature Control BGA Rework Station with Touch Screen and ±0.01mm Mounting Accuracy for Mobile Phone PCB Handling
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
Smart Temperature Control PCB Handling Equipment
Professional BGA rework station with advanced temperature control and CCD alignment system for mobile phone motherboard repair.
Model: HS-700
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W (Max), bottom heater 1200W (Max) |
| Electrical Components | Driving motor + smart temperature controller + color touch screen |
| Temperature Control | High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision) |
| Sensor | 1 piece |
| Positioning Method | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall Dimensions | L450mm × W470mm × H670mm |
| PCB Size Range | Max 140mm × 160mm, Min 5mm × 5mm |
| BGA Size Range | Max 50mm × 50mm, Min 1mm × 1mm |
| PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
| Maximum Chip Weight | 150g |
| Working Modes | Five modes: Semi-auto / Manual / Remove / Mount / Weld |
| Applications | Chips / phone motherboard repair |
Key Features
- Multilingual menu interface for global operation
- Automatic feeding device for efficient workflow
- X/Y axis joystick control for quick and convenient operation
- Imported high-definition CCD (2 million pixels) optical alignment system
- High precision temperature control sensing system with precise temperature regulation
Product Images
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Get in Touch
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Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin