High Speed Touch Screen BGA Rework Station with 5 Modes Stepping Motor and CCD Color Optical Alignment System for ±0.01mm Mounting Accuracy
Price:
Negotiable
MOQ:
1 set
Delivery Time:
7~9 work days
Brand:
HSTECH
Product Description
High Speed Touch Screen BGA Rework Station With 5 Modes Stepping Motor CCD Color
BGA Rework Station Overview
BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs). BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework.
Key Components
- Precision Heating System: Uses infrared or hot air to selectively heat BGA components for safe removal and installation
- Component Removal and Placement Tools: Vacuum nozzles and specialized tools for gentle lifting and positioning
- Alignment and Vision Systems: Cameras and software ensure precise BGA component alignment during placement
- Rework Platforms: Secure, temperature-controlled environment for the rework process
Rework Process
- Preparation: Secure PCB on rework platform and prepare area around target BGA component
- Heating: Gradual heating melts solder balls for component removal
- Removal: Careful component lifting without damaging underlying pads or traces
- Cleaning: PCB pad cleaning to remove residual solder or flux
- New Component Placement: Precise alignment and placement with reflow heating
Applications
- Electronics Repair and Rework: Replacing faulty BGA components in consumer electronics, industrial equipment, and aerospace/defense systems
- Prototype Modifications: Quick and accurate BGA rework during product development
- Production Support: BGA component rework during small-scale or batch production runs
Product Features
- 5 work modes for versatile operation
- 15" HD LCD monitor for clear visual feedback
- 7" HD color touch screen interface
- Stepping motor for precise control
- CCD color optical alignment system
- Temperature accuracy within ±1℃
- Mounting precision within ±0.01mm
- Repair success rate: 99%+
- Independent research and development of single-chip control
Technical Specifications
| Specification | Details |
|---|---|
| Model | HS-700 |
| Power Supply | AC 100V / 220V±10% 50/60Hz |
| Total Power | 2600W |
| Heater Power | Top heater 1200W (Max), bottom heater 1200W (Max) |
| Electric Material | Driving motor + smart temperature controller + color touch screen |
| Temperature Control | High precision K-sensor + closed loop control + independent temperature controller (±1℃ precision) |
| Sensor | 1 piece |
| Locating Method | V shape PCB support + external universal fixture + laser light for centering and positioning |
| Overall Dimensions | L450mm × W470mm × H670mm |
| PCB Size | Max 140mm × 160mm, Min 5mm × 5mm |
| BGA Size | Max 50mm × 50mm, Min 1mm × 1mm |
| Applicable PCB Thickness | 0.3 - 5mm |
| Mounting Accuracy | ±0.01mm |
| Machine Weight | 30KG |
| Mount Chip Weight | 150g |
| Working Modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
| Usage | Repair chips / phone motherboard etc |
Packaging & Delivery
| Item | Details |
|---|---|
| Package | 1 set into one wooden carton for safety |
| External Dimension | 450 × 470 × 670mm |
| Weight | Approximately 30kg |
| Delivery Time | Approximately 15-20 working days |
| Payment Methods | D/P, T/T, Western Union, MoneyGram |
| Port | Shenzhen |
| Shipment Options |
A. By Courier: 4-7 Working days by special offer B. By Air: 7 Working days at appointed airport C. By Sea: 20-25 Working days at appointed port |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Shenzhen Hansome Technology Co., Ltd.
Location
3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person
Rudi Jin