1. User-friendly operation: Features intuitive manual programming for easy setup and mastery.
2. Versatile trajectory options: Supports complex 3D non-planar paths including points, lines, surfaces, arcs, circles, and irregular curves.
3. Customizable parameters: Flexibly adjust gluing amount, speed, time, and stopping time to meet various process demands.
4. Stable performance: Equipped with a special controller to ensure clean, residue-free dispensing and prevent leakage.
5. Wide adaptability: Capable of dispensing, marking, and circular drawings on various product surfaces, including interiors, exteriors, facades, gaps, and spheres.
6. Personalized configurations: Tailored with fixtures, glue guns, controllers, heating temp controls, and more to suit individual needs.

This advanced equipment excels in both efficiency and precision for dispensing processes, catering to a broad spectrum of product needs. Its versatile applications encompass sensors, relays, power adapters, electronic toys, sounders, components, appliances, EV controllers, digital devices, crafts, mobile phone boards, coils, keys, battery cases, speaker bonding, and beyond.

Specifically tailored for speaker packaging & dispensing, optical semiconductor encapsulation, mobile & laptop battery packaging, PCB bonding, COB, IC, PDA, LCD packaging, and various other processes, it ensures seamless integration. Whether it's IC packaging & bonding, chassis bonding, optical device manipulation, hardware packaging coating, precise liquid filling, chip bonding, or even automotive mechanical coating & sealing, this equipment expertly fulfills each task with unmatched accuracy and efficiency, meeting the diverse demands of modern production.

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