Customizable Glue Mixing Ratio Glue Dispensing Machine For Wall Sphere
Customizable Glue Mixing Ratio Glue Dispensing Machine for Wall Sphere
- Simplified Operation: Boasts user-centric manual programming for straightforward setup and quick proficiency.
- Comprehensive Trajectory Capabilities: Accommodates intricate 3D non-planar dispensing patterns, spanning points, lines, surfaces, arcs, circles, and irregular curves.
- Adjustable Parameters: Offers flexibility to tailor gluing quantity, speed, duration, and pause times to align with diverse process specifications.
- Stable & Reliable Performance: Incorporates a specialized controller ensuring clean dispensing, zero residue, and effective leakage prevention.
- Universal Compatibility: Versatile for dispensing, marking, and circular patterns on diverse product surfaces, encompassing interiors, exteriors, edges, gaps, and spherical shapes.
- Customizable Configurations: Allows for personalized setups with fixtures, glue applicators, controllers, temperature regulators, and additional accessories tailored to individual requirements.
Specification
| ITEM | SPEC |
| Glue Mixing Ratio | 1:1-10:1/Customizable |
| Dispensing Speed | 10-150g/5s(based on 1:1 glue proportion) |
| Dispensing Precision | Glue Amount±1%, Glue Proportion±1% |
| X/Y/Z Working Range | 300*300*100mm(Z axis can be rotated) |
| XYZ Speed | Max 300mm/s |
| Drive System | Stepping Motor + Timing Belt |
| Repeatability | ±0.02mm |
| Pattern | Lines, Circles, Arcs, Continuous Paths, 3D Linear Interpolation |
| Potting Precision | Amount±1%, Ratio:±1% |
| Operation Method | Auto |
| Programming | Teach Pendant |
| Control | Board card |
| Leak-proof Function | Valve with Vacuum Device |
| Weight | 65kg |
| Dimension(L*W*H) | 716*585*645mm |
| Power Supply | 220V 50-60Hz 350W |
This cutting-edge dispensing equipment stands out for its unparalleled efficiency and precision, catering seamlessly to a wide array of product manufacturing requirements. Its versatility spans across numerous industries, including sensors, relays, power adapters, electronic toys, sounders, components, appliances, EV controllers, digital devices, crafts, mobile phone boards, coils, keys, battery cases, and speaker bonding, among others.
Designed with precision for specific tasks such as speaker packaging & dispensing, optical semiconductor encapsulation, mobile & laptop battery packaging, PCB bonding, COB, IC, PDA, and LCD packaging, it guarantees flawless integration into diverse production workflows. Irrespective of the task at hand - be it IC packaging & bonding, chassis bonding, intricate optical device handling, hardware packaging coating, accurate liquid dispensing, chip bonding, or even automotive mechanical coating & sealing - this equipment delivers exceptional performance, meeting the rigorous demands of modern manufacturing with unparalleled accuracy and efficiency.
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