Shenzhen Hansome Technology Co., Ltd.
                                                                                                           
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JUKI2000 Chip Shooter SMT Nozzle 503 E36027290A0 with Tungsten Steel and Rubber Material

Price Negotiable
Price: Negotiable
MOQ: 5pc
Delivery Time: 1-3 work days
Brand: JUKI
Product Description

Compatible with JUKI2000 Chip Shooter Silver and Green Color 503 E36027290A0

 

Introduction

 

This 503 nozzle type is compatible with the JUKI2000 Series chip mounter. Constructed from a combination of ceramic, tungsten steel, and rubber, it is ideal for placing various components such as cathode capacitors, diodes, SOTs, QFNs, BGAs, and more.

 

Specifications

 

Brand JUKI
Parts number E36027290A0
Model number M3180301021
Nozzle type 503
Chip mounter 20000series
Nozzle size 31x16mm / 1.22x0.63 inch(Height x Diameter)
Nozzle color Sliver and green
Material Tungsten steel
Weight 8g/0.353 ounces
Package Customized Blister

 

Features

 

  1. Crafted from high-quality materials including ceramic, tungsten steel, and rubber, it offers superior mounting performance and a prolonged lifespan.

  2. The nozzles are securely packaged in customized blister packs to prevent any damage during shipment.

  3. With standard sizing and zero tolerance for errors, it guarantees high precision.

  4. Designed in eco-friendly green and silver hues, it boasts an appealing appearance while adhering to environmental protection principles.

  5. Ideal for the suction and placement of components such as cathode capacitors, diodes, SOTs, QFNs, BGAs, and more.

 

JUKI 2000 Series nozzle models

 

E36087290A0 JUKI NOZZLE 500 ASSY.1.0×0.5
E36007290A0 JUKI NOZZLE 501 ASSEMBLY 0.7×0.4
E36017290A0 JUKI NOZZLE 502 ASSEMBLY O 0.7/O 0.4
E36027290A0 JUKI NOZZLE 503 ASSEMBLY O 1.0/O 0.6
E36037290A0 JUKI NOZZLE 504 ASSEMBLY O 1.6/O 1.0
E36047290A0 JUKI NOZZLE 505 ASSEMBLY O 3.5/O 1.7
E36057290A0 JUKI NOZZLE 506 ASSEMBLY O 5.0/O 3.2
E36067290A0 JUKI NOZZLE 507 ASSEMBLY O 8.5/O 5.0
E36077290A0 JUKI NOZZLE 508 ASSEMBLY O 9.5/O 8.0
 

SMT production line equipment:

 

  1. SMD Machine: This equipment, programmed to place components on designated positions, can handle SOP 28-pin or higher components (including those mounted by high-speed machines), which come in rolls, discs, or tubes. It is characterized by high mounting accuracy and versatility but operates at a speed slower than high-speed machines.

  2. Reflow Soldering: This process involves using SMT solder paste or red glue and setting an appropriate temperature profile to ensure that the solder paste and components complete the welding action.

  3. Unloader: The board is collected in the magazine via the conveyor track.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Hansome Technology Co., Ltd.
Location 3rd Floor,Building A,Sha Tang Bei Fang Yong Fa Industrial Area,Sha Jing, Bao an, Shenzhen, China
Contact Person Rudi Jin

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