Smallbatch/Multiple Offline Selective Integrated Selective Wave Soldering For THT Line
Advanced solution for DIP soldering challenges in small-batch and multiple-variety production environments.
- Enables flexible production of multiple varieties and small batches
- Quick setup for soldering without fixtures required
- Extremely low equipment purchase cost
- Minimal usage and maintenance costs (savings on tin slag, flux, electricity, and consumables)
- 100% tin penetration rate with over 98% soldering yield
- Compact footprint with extremely low covering area
In offline selective soldering mode, the soldering nozzle remains fixed while the PCB board moves along X, Y, and Z axes according to programmed settings to achieve precise soldering of PCB solder joints.
High-precision 0.5mm fluid spray nozzle using "Lumina" imported from Japan in original packaging.
Utilizes 1KW infrared heating tubes to preheat PCB board top before soldering. Meets high temperature requirements for special components, reduces thermal shock, activates flux activity, improves component pin tin penetration, and enhances soldering quality.
Employs fast infrared heat conduction to preheat PCB board before soldering and maintains heating during the process. Features synchronized "preheating + soldering" design principle that improves soldering efficiency, increases tin penetration rate, reduces thermal shock for heat-sensitive components, and ensures high cleanliness of PCB after soldering.
Centralized wiring design for easy maintenance. Features Taiwan PMI screws and tracks.
Quick detachable tin furnace design for convenient maintenance.
Liquid and gas components are independent of the electrical box, ensuring safety and reliability.
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