K Series Thermal Profiler Touch Screen USB RF Reflow Temperature Tester For Electronic Assembly

TCK Series Thermal Profiler Touch Screen USB RF For Electronic Assembly Reflow Oven Temperature Testing PCB Thermal Profiling Wave Soldering Temperature Recorder

Product Introduction

The TCK Series Thermal Profiler is a professional temperature curve testing instrument designed for reflow ovens, wave soldering machines, and other thermal process applications. It records real-time temperature data through K-type thermocouples and analyzes heating curves with dedicated software, helping manufacturers optimize soldering processes, verify oven performance, and maintain consistent product quality.

With up to 80,000 data points per channel, 0.1°C resolution, and multi-channel measurement capability, the TCK Series supports accurate profiling for SMT reflow soldering, DIP wave soldering, and other temperature-controlled manufacturing processes. It is suitable for electronics assembly, LED manufacturing, automotive electronics, and industrial coating or curing applications.

Standard Composition

Main Technical Specifications

Data analysis

PWI

Peak Temp,Times of overtop the Temp

Times of between Temp(Reflow)

Slope of between Temp(Reflow)

Slope of between Times(Wave)

Application Scenarios

• SMT Reflow Soldering Profiling
  Used to measure and optimize reflow oven temperature curves, including preheat, soak, reflow, and cooling stages.
• Wave Soldering Process Monitoring
  Supports temperature curve testing for DIP and wave soldering processes, helping verify preheat and soldering performance.
• PCBA Process Validation
  Helps confirm that temperature exposure on PCB assemblies remains within the required process window.
• LED Module and Aluminum PCB Assembly
  Suitable for thermal profiling of LED boards, aluminum substrates, and large-panel assemblies.
• Automotive and Industrial Electronics
  Supports process verification for high-reliability electronic assemblies where temperature consistency is critical.
• Coating, Curing, and Oven Process Monitoring
  Can also be applied in curing ovens, drying tunnels, and other thermal processes requiring temperature curve analysis.

Why Choose Our TCK Series Thermal Profiler

• Accurate and Reliable Measurement
  K-type thermocouples with 0.1°C resolution provide stable temperature data for process verification and optimization.
• Complete Profiling Solution
  The package includes the profiler, insulation box, thermocouples, charger, software, and accessories, making it ready for immediate use.
• Easy Data Analysis
  ProfileManager software helps visualize temperature curves, analyze key parameters, and compare multiple profiles for process improvement.
• Flexible Model Selection
  Different channel configurations allow users to choose a suitable model based on PCB size, measurement points, and production requirements.
• Portable and Factory-Friendly
  Compact design and protective insulation box make it convenient for daily oven profiling and line-side process checks.
• Technical Support Available
  We can help confirm the suitable channel configuration, thermocouple setup, and software functions according to your reflow or wave soldering process.

Contact Us for a Quote

If you need a reliable thermal profiler for reflow oven profiling, wave soldering verification, or process optimization, the TCK Series Thermal Profiler can help improve temperature control and production consistency.

Please share your required number of channels, application scenario, oven type, and any specific software or wireless transmission needs. We will recommend a suitable model and provide a quotation accordingly.