MC-PDIS12 51402625-175 CC EA Honeywell PLC Module Di - Soe Redundant Iop

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Honeywell MC-PDIS12 51402625-175 DI-SOE REDUNDANT IOP, CC EA honeywell plc​

Lead time:3-5 days

New with one year warranty

The High-Performance Process Manager subsystem (HPM) consists of major assemblies described in the following subsections. The major High-Performance Process Manager assemblies are • High-Performance Process Manager Module (HPMM) card file • Input/Output Processor (IOP) card file • Input/Output Processor (IOP) card • I/O Link Extender • Field Termination Assembly (FTA) • Power System

Overview, Continued Nonredundant HPM cabinet layout Figure 2-1 is an illustration of a single High-Performance Process Manager cabinet containing a nonredundant High-Performance Process Manager Module (HPMM) with supporting assemblies. The HPMM cards (2) and the IOPs cards are installed in 15-Slot HPMM card files. IOP cards occupy the IOP card files

Card Files Introduction There are nine card file models. Three models are not CE Compliant and six models are CE Compliant. Table 2-1 lists the nine card file models. All models are also available with conformal coating (a model number with a prefix of MC, rather than MU).

The non-CE Compliant card file models can be designated as an HPMM card file or an IOP card file by either installing an HPMM card set in the two left-most card slots or installing IOP cards.

Unlike the non-CE Compliant card file models, the CE Compliant card file models are designated either an HPMM card file or an IOP card file because even though their is no electrical difference in the backpanel, they differ mechanically. The addition of a ground plate and filtered IOP connectors in the two left-most slots prohibits the installation of an HPMM card set. The card file is designated an IOP card file when the ground plate and filtered connectors are present. The card file is designated an HPMM card file when the ground plate and filtered connectors are absent.