MoCu15-MoCu50 Molybdenum Copper Rod Heat Sink Sealing Materials
Molybdenum Copper Rod MoCu 85/15 , MoCu 60/40 Bright Ground Finished Surface
It is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy rods for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy rod
Description
| Types | Cu | Mo | Impurities |
| MoCu10 | 10+/-2 | Base | ≤0.1 |
| MoCu15 | 15+/-3 | Base | ≤0.1 |
| MoCu20 | 20+/-3 | Base | ≤0.1 |
| MoCu25 | 25+/-3 | Base | ≤0.1 |
| MoCu40 | 40+/-5 | Base | ≤0.1 |
It is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy rods for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy rod
Molybdenum Copper Rod Advantages:
1. 40% higher than similar tungsten-copper composites.
2. Maximum thermal conductivity
3. Thermal performance and mechanical properties
4. Thermal expansion
5. No need for expensive molds
6. High-precision parts processing
7. Electroplating and metal options
8. Sealing
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