Low Density Molybdenum Copper Alloy Plate For Electronic Components
Molybdenum Copper Plate Mo60Cu40 / Mo70Cu30 / Mo80Cu20 heat sink sealing
Molybdenum Copper Plates can be processed with the content (Mo85Cu15 , Mo80Cu20 , Mo70Cu30 , Mo60Cu40 , Mo50Cu50) MoCu 85/15 Molybdenum-Copper Composite Material , MoCu 70/30 Molybdenum-Copper Composite Material , MoCu 65/35 Molybdenum-Copper Composite Material , Molybdenum-Copper Composite AMC 7525
Description
Molybdenum Copper Plate is used to manufacture military high-power microelectronic devices as heat sink sealing materials and molybdenum-copper alloy sheets for sealing and structural materials of aluminum oxide ceramics. It is also suitable for manufacturing high thermal conductivity expansion sealing heat in civil high-power microelectronic devices. Sedimentary molybdenum copper alloy plate
| Type | Mo Wt% | Cu Wt% | g/cm3 | W/(M.K) | (10-6/K) |
| Mo85Cu15 | 85± 1 | Balance | 10 | 160 - 180 | 6.8 |
| Mo80Cu20 | 801 | Balance | 9.9 | 170 - 190 | 7.7 |
| Mo70Cu30 | 701 | Balance | 9.8 | 180 - 200 | 9.1 |
| Mo60Cu40 | 601 | Balance | 9.66 | 210 - 250 | 10.3 |
| Mo50Cu50 | 50 ±0.2 | Balance | 9.54 | 230 - 270 | 11.5 |
| Material Notes: | Characteristics:
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Molybdenum Copper Wafer substrate
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Molybdenum Copper Heat sink
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Molybdenum Copper Rod
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