High Pure Molybdenum Products Implantation Ion Parts In Semiconductor Industry
High-Pure Moly Implantation Ion Parts In Semiconductor Industry
Moly Implantation Ion Parts are an ion beam technology that ionizes the atoms of the elements into ions, accelerates them at a voltage of tens to hundreds of kV, and then implants them into the workpiece material placed in the vacuum target chamber after obtaining high speed. surface.
After ion implantation, the physical, chemical and mechanical properties of the material surface will change significantly. The continuous wear resistance of the metal surface can reach 2 to 3 orders of magnitude of the initial injection depth.
SPECIFICATION & CHEMICAL COMPOSITIONS (NOMINALS)
| Material | Type | Chemical Composition (by wt.) |
| Pure Moly | Mo1 | >99.95%min. Mo |
| Ti-Zr-Mo Alloy | TZM | 0,5 % Ti / 0,08 % Zr / 0,01 - 0,04 % C |
| Mo-Hf-C | MHC | 1,2 % Hf / 0,05 - 0,12 % C |
| Moly Rhenium | MoRe | 5,0 % Re |
| Moly Tungsten | MoW20 | 20,0 % W |
| Moly Tungsten | MoW505 | 0,0 % W |
APPLICATIONS of Moly Implantation Ion Parts
- Precision molds in semiconductor industry, stamping and stamping molds in can industry can significantly improve the working life of these valuable and precision molds;
- Precision motion coupling components, such as stator and rotor of air extraction pump, cam and chuck of gyroscope, piston, bearing, gear, turbine vortex rod, etc., can greatly reduce the friction coefficient, improve wear resistance and corrosion resistance, and prolong the service life up to more than 100 times;
- Hot extrusion and injection mold can reduce energy consumption by about 20% and prolong service life by about 10 times;
Moly Ion Implantation Parts Picture:
Advantages of Moly Implantation Ion Parts technology:
(1) It is a pure pollution-free surface treatment technology;
(2) It does not need thermal activation and high temperature environment, so it will not change the overall dimension and surface finish of the workpiece;
(3) Ion implantation layer is a new surface layer formed by a series of physical and chemical interactions between ion beam and substrate surface, and there is no peeling problem between it and substrate;
(4) There is no need for machining and heat treatment after ion implantation.
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