China Produces 3W,5W UV Laser Marking ,Laser Scribing, Laser Cutting Machines

1, equipment introduction

3W, 5W UV laser marking machine belongs to the series of laser marking machines, which integrates international advanced technology. High-energy UV photons directly destroy the molecular bonds on the surface of many non-metallic materials, so that the molecules are separated from the object. This method will not produce High heat, very small gathering spot of ultraviolet laser, and almost no damage due to thermal influence, so it is called cold processing. The ultraviolet laser marking machine is developed by using a 355nm ultraviolet laser. Compared with the infrared laser technology, the 355 ultraviolet light has a very small focusing spot, which can greatly reduce the mechanical deformation of the material and has a small thermal impact on processing. Because it is mainly used for ultra-fine marking and engraving, it is especially suitable for food and pharmaceutical packaging. Material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers!

2, equipment features

1. Due to the extremely small focusing spot and the small processing heat affected zone, the ultraviolet laser can carry out ultra-fine marking and is the first choice for customers who have higher requirements on the marking effect;

2. In addition to copper materials, UV lasers are suitable for a wider range of materials;

3. Not only the beam quality is good, the focusing spot is smaller, and ultra-fine marking can be realized;

4. The scope of application is wider; the heat-affected area is extremely small, no thermal effect will occur, and no material scorching problem will occur;

5. The marking speed is fast and the efficiency is high; the whole machine has the advantages of stable performance, small size and low power consumption;

3, equipment parameters

4, device application

1. Suitable for surface marking and micro-hole processing of glass, polymer materials and other objects;

2. It is widely used in the surface marking of packaging bottles (boxes) of polymer materials such as food, medicine, cosmetics and wires;

3. Flexible PCB board, LCD, TFT marking, scribing and cutting, etc.;

4. Metal or non-metallic coating removal;

5. Silicon wafer micro-hole and blind-hole processing;