100-200 Times Service Life 1.5-2.0mm Thick FPC PCB (Flexible Printed Circuit Board) Cushion Pad MKCP-FPC-G3
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Brand:
MK
Product Description
MKCP-FPC-G3 FPC Cushion Pad
100-200 Times Service Life 1.5-2.0mm Thick FPC PCB (Flexible Printed Circuit Board) Cushion Pad
Product Overview
FPC (Flexible Printed Circuit) cushion pads are specialized buffering materials designed for flexible PCB lamination processes. These high-performance pads offer exceptional flexibility, durability, and thermal resistance for modern electronic manufacturing applications.
| Specification | Value |
|---|---|
| Service Life | 100-200 times |
| High Temperature Resistance | ≤260℃ |
| Thickness | 1.5-2.0mm |
| Thickness Tolerance | ±0.3mm |
| Size Tolerance (Length or Width) | ±2mm |
| Tensile Strength | ≥ 25 MPa |
| Buffer Standard | ≥ 12% |
| Water Absorption Standard | < 8% (3-8%) |
Key Features
- Extended service life of 100-200 lamination cycles significantly reduces production costs
- Superior performance in flatness, wear resistance, and dimensional stability compared to traditional Kraft paper
- Excellent high-temperature resistance up to 260℃ without carbonization or brittleness
- Optimal buffering effect and thermal conductivity with stable compression and expansion coefficients
- Flame retardant, non-toxic, odorless, dust-free with excellent breathability
- Good tear resistance for reliable performance in automated operations
Product Structure
The FPC cushion pad replaces multiple sheets of hot press Kraft paper with a single, reusable pad, saving production material costs by at least 20%. The multi-layer structure includes:
- Silastic layer
- High elasticity fiber
- High molecular weight polymer
- Tensile tear layer
Technical Specifications
- Service life: 100-200 cycles
- High temperature resistance: ≤260℃
- Thickness: 1.5-2.0mm
- Thickness tolerance: ±0.3mm
- Size tolerance (length or width): ±2mm
- Tensile strength: ≥ 25 MPa
- Buffer standard: ≥ 12%
- Water absorption standard: < 8% (3-8%)
Applications
Specially developed for hot lamination buffering during flexible PCB manufacturing, the MKCP-FPC-G3 cushion pad delivers comprehensive lamination performance and higher stability. It significantly improves yield and efficiency in flexible PCB and flexible-rigid PCB lamination processes.
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Company
MKarte Material Technology (Tianjin) Limited
Location
F4, Building#1, Shijihuayuan, Dagang, Binhai New Area, Tianjin, China 300270
Contact Person
Jessie