JOPTEC LASER CO., LTD
                                                                                                           
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Gold Plating SMD Ceramic Hybrid Integrated Circuit Package

Price Negotiable
Price: Negotiable
MOQ: 50 PCS
Delivery Time: 30 Days
Brand: JOPTEC
Product Description

Technical characteristics:

 

Micro channel heat sink

Flatness of chip mounting area ≤ 2 um

Roughness of chip mounting area ≤ 0.3 um

Plating thickness: Ni (2-5um)

Au (0.05-0.15um)

Water flow ≥ 300ml/min


High thermal conductivity aluminum nitride ceramic heat sink

Types of Ceramic: Aluminum Nitride AlN

Thermal conductivity: 200 W/m.K

Roughness of metallized area: Ra 0.5um Max

Flatness of metallized area: 5um Max

Copper thickness accuracy: 75±10 um

Preset gold tin solder: Au (75±5wt%) Sn

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company JOPTEC LASER CO., LTD
Location No.451 Huangshan Road, Hefei, Anhui, China
Contact Person JACK HAN

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