Gold Plating SMD Ceramic Hybrid Integrated Circuit Package
Price:
Negotiable
MOQ:
50 PCS
Delivery Time:
30 Days
Brand:
JOPTEC
Product Description
Technical characteristics:
Micro channel heat sink
Flatness of chip mounting area ≤ 2 um
Roughness of chip mounting area ≤ 0.3 um
Plating thickness: Ni (2-5um)
Au (0.05-0.15um)
Water flow ≥ 300ml/min
High thermal conductivity aluminum nitride ceramic heat sink
Types of Ceramic: Aluminum Nitride AlN
Thermal conductivity: 200 W/m.K
Roughness of metallized area: Ra 0.5um Max
Flatness of metallized area: 5um Max
Copper thickness accuracy: 75±10 um
Preset gold tin solder: Au (75±5wt%) Sn
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Company
JOPTEC LASER CO., LTD
Location
No.451 Huangshan Road, Hefei, Anhui, China
Contact Person
JACK HAN