Hybrid Integrated Circuit Package
Hermetic Hybrid Integrated Circuit Package
Main performance parameters Application fields: DCDC power supply, filter, modulator Lead welding method: tin welding, gold wire bonding Nickel layer thickness: >3μm Gold layer thickness:> 0.45μm Hermeticity: leak rate ≤1x10-3Pa.cm3/s(He) Insulation resistance: ≥1000MΩ (DC500V) material: Base: Kovar alloy, iron-nickel alloy, copper Ring frame: Kovar alloy, steel Lead: Kovar alloy, iron-nickel alloy, copper core composite Cover plate: Kovar alloy, iron-nickel alloy, steel
Gold Plating SMD Ceramic Hybrid Integrated Circuit Package
Technical characteristics: Micro channel heat sink Flatness of chip mounting area ≤ 2 um Roughness of chip mounting area ≤ 0.3 um Plating thickness: Ni (2-5um) Au (0.05-0.15um) Water flow ≥ 300ml/min High thermal conductivity aluminum nitride ceramic heat sink Types of Ceramic: Aluminum Nitride AlN Thermal conductivity: 200 W/m.K Roughness of metallized area: Ra 0.5um Max Flatness of metallized area: 5um Max Copper thickness accuracy: 75±10 um Preset gold tin solder: Au (75
Ceramic Metal Insulator Al2O3 Hybrid Integrated Circuit Package
Product name: High quality Customized Ceramic To Metal Sealing Package Product formation Material Quantity bottom CS1010 1 lead1 oxgyen free copper 4 lead 2 copper cored alloy 8 insulator Al2O3 12 Plating coating: Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um. Hermeticity: Leak rate
Extended Bottom Brazing Hybrid Integrated Circuit Package
Product name: Metal Base Cavity Kovar/Aluminium Package for IC Finish: Fully plating Au. (Fully plating or selective plating Au.) Plating Coating Header and lid are plated Ni:1.3~11.43um and civil levelHeader is plated Au ≥1um military level:Header is plated Au≥1.3um;Lid:civil level Lid is plated Au:0.6~2um;military level:Lid is plated Au:0.6~2um Product information: Material Quantity 1. Cover plate 4J42(42alloy) 1 2. Inner cover plate Al 2A12 1 3. Welding frame HLAgCu28 1 4.