CMC 02 metallized ceramics components
CMC 02 metallized ceramics components
1.Application Field:
High Vacuum-tight Ceramic-to-metal joints with extremely high bond strengths, excellent consistency and high mechanical strength are good at heat transfer properties, minimum electric resistance and vacuum tightness. The metallic layers make the component suitable for integration by means of both hard and soft soldering. It’s widely used in typical applications such as Defense and Aerospace, Communications, lightning-protection, over current and over voltage protector etc.
2.Key Words:
Manufacture samples , open mould ,aluminum oxide,thick-film nickel plating technology,copper and alloys,great limberness,Good corrosion resistance,High intensity,Good high-temperature resistance performance,High purity.
3.Parameters:
| Product Parameters | ||
| Physical Property | Material | 95% Alumina |
| Production Process | Dry Pressing+Brazing | |
| Product Dimension | Per customers' drawing | |
| Density (g/cm3) | 3.70-3.75g/cm3 | |
| Water Absorption | 0% | |
| Mechanical Performance | Flexural Strength (Mpa) | 310Mpa |
| Modulus of Elasticity (Gpa) | 310Gpa | |
| Hardness (Gpa) | 12.9Gpa | |
| Poisson Ratio | 0.23 | |
| Thermal Character | Linear Thermal Expansion Coefficient | 7.2 |
| Heat Conductivity (W/mk) | 23 | |
| Electrical Property | Dielectric Constant | 9.2 |
| Dielectric Loss Tangent (x10-4) | 8 | |
| Insulation Strength (x106V/M) | 15 | |
| Metalized Ceramic Performance | Air Tightness (Pa·m3/s) | ≤10-8 |
| Bulk Resistivity (Ω·cm) | ≥1010 (20°C), ≥106 (300°C) | |
| Bonding Strength (Mpa) | ≥120Mpa | |
| Metallization Thickness (μm) | ≥20μm | |
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