3.7g/cm3 HAP 96% Aluminum Oxide Ceramic Components
HAP 96% aluminum oxide ceramic assembly
1. Description:
HAP 96% aluminum oxide ceramic assembly is produced with high-purity toughened alumina ceramics and thick-film nickel plating technology.It is suitable for brazing different materials such as copper and alloys. It can meet the requirements of seismic and tensile at the same time, and it can withstand high current and arc shock. Reaching the reliable sealing and insulation standards of DC high-voltage relays, it is currently an excellent technical solution in the field of new energy vehicles and DC high-voltage electronic control.
Our products are made using high-quality materials, including aluminum oxide and copper alloys, manufactured through a process that involves open mould design and thick-film nickel plating technology. These manufacturing techniques ensure the resulting products offer great limberness, good corrosion resistance, high intensity, and good high-temperature resistance performance. The high purity of our products makes them ideal for a range of applications where contamination is a concern. Whether you need samples for testing purposes or require a reliable solution for your production needs, our products offer the quality and durability you need.
2. Key Words:
Manufacture samples , open mould ,aluminum oxide,thick-film nickel plating technology,copper and alloys,great limberness,Good corrosion resistance,High intensity,Good high-temperature resistance performance,High purity.
3. Parameters table:
| Product Parameters | ||
| Physical Property | Material | 95% Alumina |
| Production Process | Dry Pressing | |
| Product Dimension | Per customers' drawing | |
| Density (g/cm3) | 3.70-3.75g/cm3 | |
| Water Absorption | 0% | |
| Mechanical Performance | Flexural Strength (Mpa) | 310Mpa |
| Modulus of Elasticity (Gpa) | 310Gpa | |
| Hardness (Gpa) | 12.9Gpa | |
| Poisson Ratio | 0.23 | |
| Thermal Character | Linear Thermal Expansion Coefficient | 7.2 |
| Heat Conductivity (W/mk) | 23 | |
| Electrical Property | Dielectric Constant | 9.2 |
| Dielectric Loss Tangent (x10-4) | 8 | |
| Insulation Strength (x106V/M) | 15 | |
| Metalized Ceramic Performance | Air Tightness (Pa·m3/s) | ≤10-8 |
| Bulk Resistivity (Ω·cm) | ≥1010 (20°C), ≥106 (300°C) | |
| Bonding Strength (Mpa) | ≥120Mpa | |
| Metallization Thickness (μm) | ≥20μm | |
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