2.5w/M.K 1.2g/Cm3 Thermal Phase Change Material
PCM Phase Change Material Micro-Capsule Thermal Interface Material Aluminum Foil Carrier
The material is heat reinforced polymer, designed to meet the Thermal conductivity and reliability demand for the thermal conductivity of high application terminal. In addition, the heat sink’s performance benefits a lot from the low heat resistance. And improve the microprocessor, DC - DC converter of memory module and the reliability of power module. The phase change characteristics: the material is solid in room temperature and installation is completely convenient, used between heatsink and devices. The material can be softened and flowing when the products reach phase-change temperature to fill the devices’ tiny irregular contact surface. Thus, the material has the ability to fill the gap between the devices and heat sink completely, make the phase change better than non-current elastomers or thermal graphite pad and get the performance of thermal conductive silicon grease. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material can not
Features & Benefits:
1. Low heat resistance and low stress
2. Natural sticky, easy to use-no need to use glue
3. No radiator preheating
4. Flow but not silicon oil
5. Low volatility--less than 1%
Physical properties
| Test Item | Unit |
Test Result |
|||
|
PCM-A |
PCM-B |
PCM-P |
PCM-Y |
||
|
Color |
- |
Gray |
Black |
Pink |
Yellow |
|
Carrier |
- |
- |
Aluminum foil |
- |
- |
|
Thermal Impedance |
℃in2/w |
0.035 |
0.03 |
0.05 |
0.05 |
|
Thermal Conductivity |
W/m·K |
2.5 |
2.5 |
1 |
1 |
|
Phase Change Temp |
℃ |
50~60 |
50~60 |
50~60 |
50~60 |
|
Breakdown Voltage |
KV/mm |
≥6 |
≥6 |
≥7 |
≥7 |
|
Dielectric Constant |
@1MHz |
4.5 |
4.5 |
4.6 |
4.6 |
|
Density |
g/cm3 |
1.2 |
2.2 |
1.3 |
1.35 |
|
Thickness |
mm |
0.13/0.2 |
0.18/0.25 |
0.13/0.2 |
0.13/0.2 |
|
Storage Temp |
℃ |
<40 |
<40 |
<45 |
<45 |
|
Temperature Range |
℃ |
-45~125 |
-45~125 |
-45~125 |
-45~125 |
|
Storage Time |
Month |
12 |
24 |
12 |
12 |
Product Details
PackageAnd Shipping
FAQ
Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.
Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.
Q: Are thermal pads offered with tacky?
A: Yes, all the thermal pads have its inherent tacky. All the models are natural tacky for two sides, except for the LCP series ,only one side has natural tacky. LCB series thermal pads can be cover 3M glue with strong
adhesive.
Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.
Q:Will the heat make the thermal pads softer?
A: ShoreC 20~80 ,there is no significant change in the hardness of thermal pads, as gap filler.
Q: What’s the tolerance for the thickness?
A :Normally ±0.1mm.
Q: Are the thermal pads electrical insulating?
A: Yes, all thermal pads are electrically isolated.
Q: What’s the shelf life for thermal pads?
A: Shelf life for thermal pad is one year after the date of manufacture. For the pads with adhesive, the shelf life is 6months after the date of manufacture. After these dates, all the characters should be retested.
Q: Can the thermal pads be with fiberglass?
A: YES, we could have thermal pads with fiberglass center to improve customer specific requirements for the tensile strength.LCP series has fiberglass on its surface, all other models will be made at your requirement.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.