Shenzhen Linmao Electronic Material Co.,Ltd.
                                                                                                           
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10 Years
Since 2016
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0.5mm Thickness 1.5w/M.K Thermally Conductive Adhesive Transfer Tape

Price Negotiable
Price: Negotiation
MOQ: Negotiation
Delivery Time: 3~8 Days
Product Description
Adhesive Tape Double Sided Thermal Conductive Tape For Insulation Transfering
 
Product Description
 
    M-TS040 fiberglass thermally conductive adhesive tape are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing

 

Features

  • Good thermal conductivity 
  • High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape. 
  • High performance, thermally conductive acrylic adhesive. 

Applications

 

l Mount heat sink onto BGA graphic processor or drive processor.

l Mount heat spreader onto power converter PCB or onto motor control PCB.

Can be used instead of heat cure adhesive, screw mounting or clip mounting.

 

 

Application Modes

 

The filling between PCB and heat sink

The filling between IC and heat sink or product outer coving

The filling between IC and similar heatsink cooling materials

 

LED Lighting Thermal Tape Properties

 

 

Test item

Test method Unit Test Value

 

Color

Visual / white

 

Thickness

ASTM D374 Mm 0.05 to 0.5

 

Specific Gravity

ASTM D792 g/cm3 1.8±0.1
Tensile Strength

 

ASTM D412

kg/cm2 8

 

ASTM D412

Pa 5.88*10 9

 

Continuous Use Temp

EN344 -40 to +250

 

Volume Resistivity

ASTM D257 Ω-CM 1.1*1011

 

Breakdown Voltage

ASTM D149 KV/mm 4

 

Flame Rating

UL-94 / V-0

 

Conductivity

ASTM D5470 w/m-k 1.5

   

 
Detailed Images
 
 
 
 
Packing & Shipping
 
 
 
FAQ ​                                                                                                                                  

Q:What’s the thermal conductivity test method given on the data sheet?
A: All the data in the sheet are tested out by the third party. ASTM D5470 is utilized to test the thermal conductivity.

Q: How to find a right thermal conductivity for your application?
A: It depends on the watts of power source, ability of heat dissipation. For any customers, please contact us for the technical support.

 

Q: Are thermal pads reworkable?
A: It’s depend on the application and the pad being used. Thermal pads have been reused before, however,it’s up to the judgment of product designer, to see whether the pads could withstand reuse.

Q:Will the heat make the thermal pads softer?
A: ShoreC 20~80 ,there is no significant change in the hardness of thermal pads, as gap filler.

Q: What’s the tolerance for the thickness?
A :Normally ±0.1mm.

Q: Are the thermal pads electrical insulating?
A: Yes, all thermal pads are electrically isolated.

Q: What’s the shelf life for thermal pads?
A: Shelf life for thermal pad is one year after the date of manufacture. For the pads with adhesive, the shelf life is 6months after the date of manufacture. After these dates, all the characters should be retested.

Q: Can the thermal pads be with fiberglass?
A: YES, we could have thermal pads with fiberglass center to improve customer specific requirements for the tensile strength.M-TS series has fiberglass on its surface, all other models will be made at your requirement.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Linmao Electronic Material Co.,Ltd.
Location 201, Building A, N0.60, Xiakeng 2nd Road, Tongde Community, Baolong Street, Longgang District, Shenzhen
Contact Person Linda

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