Shenzhen Linmao Electronic Material Co.,Ltd.
                                                                                                           
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10 Years
Since 2016
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3.0g/Cm3 30 Shore C Silicone Thermal Putty For LED

Price Negotiable
Price: Negotiation
MOQ: Negotiation
Delivery Time: 5~8 Days
Product Description

High Thermal Conductivity Silicone Thermal Putty For PCB/LED/CPU

 

Product Description
 
 
Product Name
 
Heat sink thermal conductivity silica gel
 
Material
 
Silicone
 
Function
 
Heat dissipation
 
Package
 
According to customer requirements

 

    M-TN300 thermal gel is a very low thermal conductivity material with a certain degree of fluidity and plasticized plasticity. It is suitable for heat dissipation modules or components with large thickness changes. Its inherent adhesive properties, without bonding layer, and has good wettability, can cover the micro-uneven surface so that the matching parts fully contact and improve the heat transfer efficiency.  And this single component precuring heat conducting gel is applied to all kinds of components with low stress requirement to make the products have high reliability. The product is self-adhesive and easily assembled. Meanwhile, customers can automatically dispense glue according to their own process to improve production efficiency.
 

 

Property

 

Unit

 

M-TN300

 

Test Method

 

Color

 

-

 

Multicolor

 

Visual

 

Extrusion rate

 

 

g/min

 

30

 

30cc Syringe & 0.1”Needle @90psi

 

Hardness

 

Shore C

 

30-60

-

 

Thermal conductive

 

W/m·K

 

3.0

 

ASTM D5470

 

Thermal resistance

 

@ 20 psi

0.10°C·in2/W

0.65°C·cm2/W

ASTM D5470

 

Flame Rating

 

-

 

94 V-0

 

U.L.

 

Breakdown Voltage

 

kV(@1mm)

 

>10.0

 

ASTM D149

 

Volume

 

Ω·cm

 

1.0×1014

 

ASTM D257

 

Density

 

g/cm3

 

3.0

 

ASTM D792

 

Dielectric Constant

 

@1 MHz

 

6.3

 

ASTM D150

Permeability

TML (CVCM)

 

%

 

≤0.15 (0.05)

 

ASTM E595

Continuous service temperature

 

°C

 

-60 to 200

 

***

 

RoHS Compliant

 

-

 

Yes

 

***

 

 

 

Features

  • Thermal conductivity:2.0~5.0 W/m·K
  • Fluid-type thermal conductive filling material
  • Good plasticity, can replace the use of thermal conductive silicone grease
  • Excellent wettability to reduce contact thermal resistance
  • Flame Rating:V-0
Product Usage
 
* Smart Phone, Tablet computer
* Communication equipment
* Power module
* High power LED
* Military Equipment
* Power Semiconductor

 

 

Product Details

 

one-component: 30ML 300ML 5KG 10KG

Double components: 50ML 400ML 5KG 10KG

Performance R&D customization

Develop products according to customers' special requirements.

 

 

Shipping

 

 

 

FAQ

 

1. What are your main products?
We supply thermally conductive pad, graphene Material, thermal adhesive tape, thermally double component silicone, thermally conductive materials, phase change thermal interface materials, thermally conductive insulators and thermal grease. Samples of silicone thermally conductive sheet are available, but the freights need to be paid by the buyers.

 

2. What about the product quality and which certificate do you have?
We have UL certificate,ISO9001,ISO14001 and ROHS certificate.

 

3. How long does it take to deliver after order?
For small quantity, we arrange delivery within one week normally while for big quantity, we will arrange delivery as soon as
possible according to actual situation and customer's requirements.

 

4. What about your after-sale service?
We fully guarantee our product quality and will provide free technical guidance on operations.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen Linmao Electronic Material Co.,Ltd.
Location 201, Building A, N0.60, Xiakeng 2nd Road, Tongde Community, Baolong Street, Longgang District, Shenzhen
Contact Person Linda

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