Bicheng Electronics Technology Co., Ltd
                                                                                                           
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2L High Frequency PCB Based On 5mil RT Duroid 5870 Substrates With Immersion Gold

Price Negotiable
Price: USD9.99/PCS-99.99/PCS
MOQ: 1PCS
Delivery Time: 8-9 working days
Brand: Bicheng
Product Description

Introducing our newly shipped RF PCB which is based on rogers RT duroid 5870 material. Rogers RT/duroid 5870 high-frequency laminates are composite materials made of PTFE reinforced with glass microfibers. These laminates offer exceptional high-frequency performance with a low dielectric constant (Dk). The random orientation of microfibers in the PTFE composite ensures consistent Dk values. RT/duroid 5870 laminates are ideal for applications requiring high frequency and broadband performance, where minimizing dispersion and losses is crucial.

 

Features:

Dielectric Constant: Boasting a low dielectric constant (Dk) of 2.33 with a tight tolerance of 0.02 at 10 GHz/23°C, the RT/duroid 5870 PCB ensures optimal signal integrity and minimized dispersion.

 

Dissipation Factor: With an impressively low dissipation factor of 0.0012 at 10 GHz, this PCB guarantees minimal signal loss, making it an ideal choice for high-frequency and broadband applications.

 

Temperature Stability: The temperature coefficient of dielectric constant (TCDk) of -115 ppm/°C ensures consistent performance even in varying temperature environments.

 

Moisture Absorption: Benefit from superior moisture resistance, as the RT/duroid 5870 PCB exhibits a moisture absorption rate of just 0.02%, providing reliability in high moisture environments.

 

Dimensional Stability: Enjoy excellent dimensional stability with a CTE (Coefficient of Thermal Expansion) of 22 ppm/°C (X-axis), 28 ppm/°C (Y-axis), and 173 ppm/°C (Z-axis), ensuring reliable performance under changing thermal conditions.

Isotropic Design: The RT/duroid 5870 PCB features an isotropic design, delivering uniform electrical properties across different directions.

 

RT/duroid 5870 Typical Value
Property RT/duroid 5870 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.33
2.33±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.33 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0005
0.0012
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -115 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1300(189) 490(71) X
1280(185) 430(63) Y
Ultimate Stress 50(7.3) 34(4.8) X
42(6.1) 34(4.8) Y
Ultimate Strain 9.8 8.7 X %
9.8 8.6 Y
Compressive Modulus 1210(176) 680(99) X MPa(kpsi) A ASTM D 695
1360(198) 860(125) Y
803(120) 520(76) Z
Ultimate Stress 30(4.4) 23(3.4) X
37(5.3) 25(3.7) Y
54(7.8) 37(5.3) Z
Ultimate Strain 4 4.3 X %
3.3 3.3 Y
8.7 8.5 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.22 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 22
28
173
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 27.2(4.8) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

 

Benefits:

Optimal Electrical Performance: Experience the lowest electrical loss among reinforced PTFE materials, guaranteeing efficient and reliable signal transmission in your electronic designs.

 

Ease of Processing: The RT/duroid 5870 PCB is easy to cut, shape, and machine, allowing for flexible customization to meet your specific project requirements.
 

Chemical Resistance: Enjoy resistance to solvents and reagents used in etching or plating processes, ensuring long-lasting durability and reliability.

 

Wide Range of Applications: This versatile PCB is suitable for various applications, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave systems, radar systems, guidance systems, and point-to-point digital radio antennas.

 

Proven Reliability: The RT/duroid 5870 PCB is built using a well-established material trusted by industry professionals, ensuring consistent and proven performance.

 

Wide Frequency Range: Achieve uniform electrical properties over a broad frequency range, enabling reliable operation across diverse electronic systems.

 

 

PCB Specifications:

PCB Stackup: 2-layer rigid PCB
Copper Layer Thickness: 35 μm (both layers)
RT/duroid 5870 Thickness: 0.127 mm (5mil)
Board Dimensions: 60.8mm x 60.8 mm (± 0.15mm)
Minimum Trace/Space: 4/4 mils
Minimum Hole Size: 0.2mm
Finished Board Thickness: 0.2mm
Finished Copper Weight: 1oz (1.4 mils) outer layers
Via Plating Thickness: 20 μm
Surface Finish: Immersion gold
Silkscreen: Top (White), Bottom (None)
Solder Mask: Top (None), Bottom (None)
Electrical Testing: Rigorously tested to ensure 100% functionality prior to shipment

 

Additional Information:

PCB Statistics: 8 components, 19 pads (10 thru-hole pads, 9 top SMT pads, 0 bottom SMT pads), 7 vias, 2 nets
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Available worldwide


Elevate the performance of your electronic designs with the outstanding high-frequency capabilities of the RT/duroid 5870 PCB. Unleash enhanced efficiency, reliability, and versatility in your projects.

 

For further information, please contact our team at sales10@bichengpcb.com. We offer worldwide availability and are ready to assist you with your RF PCB needs.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact Person Ivy Deng

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