Introducing the IT-180ATC PCB
The IT-180ATC is a cutting-edge, high Tg (175°C) multifunctional filled epoxy laminate designed for advanced electronic applications. With its exceptional thermal reliability and resistance to conductive anodic filaments (CAF), the IT-180ATC is well-suited for demanding environments, including automotive, telecommunications, and data storage systems. This laminate can withstand lead-free assembly processes up to 260°C, making it a versatile choice for modern manufacturing needs.

Key Advantages of the Material

1. High Glass Transition Temperature (Tg): With a Tg of 175°C, the IT-180ATC can maintain its structural integrity and electrical properties in high-temperature settings, making it ideal for automotive engine control units (ECUs) and other demanding applications.

2. Lead-Free Process Compatibility: The IT-180ATC is engineered to withstand lead-free assembly processes up to 260°C, making it compliant with contemporary manufacturing standards.

3. Excellent Thermal Expansion Properties: The PCB features a low coefficient of thermal expansion (CTE), with X-Axis values of 11-13 ppm/°C and Y-Axis values of 13-15 ppm/°C, ensuring dimensional stability during thermal cycling.

4. CAF Resistance: The material exhibits excellent resistance to CAF, which is crucial for maintaining reliability in humid environments where conductive paths can form.

Technical Specifications

The IT-180ATC PCB is meticulously designed to meet rigorous performance standards. Key specifications include:

- Dielectric Constant (DK): 4.4 at 1 GHz and 4.5 at 1 MHz, supporting effective signal integrity.
- Dissipation Factor (Df): 0.014 at 1 MHz and 0.015 at 1 GHz, indicating minimal energy loss during operation.
- Moisture Resistance: With a moisture absorption rate of only 0.1%, the IT-180ATC is resilient in various environmental conditions.
- Flammability Rating: The material complies with UL94-V0 standards, ensuring it meets safety requirements in critical applications.

Construction

The IT-180ATC PCB features a robust 4-layer rigid construction, comprising:

- Copper Layers: Four layers of 0.035 mm copper provide excellent conductivity.
- Core Material: A 1.03 mm IT-180ATC core, sandwiched between layers of prepreg, contributes to its thermal and electrical performance.
- Finished Board Thickness: 1.6 mm, providing a solid foundation for electronic components.
- Board Dimensions: 130 mm x 175 mm, with a tolerance of +/- 0.15 mm, allowing for precision in complex designs.

Quality Assurance

Prior to shipment, every PCB undergoes rigorous 100% electrical testing, ensuring compliance with IPC-Class-2 quality standards. This meticulous process guarantees that each board meets high-performance expectations, instilling confidence in our customers.

Applications
The IT-180ATC PCB is ideal for a variety of applications, including:

Automotive Engine Room ECU
Backplanes for data transmission
Data Storage systems
Servers and Networking equipment
Telecommunications devices

Conclusion

The IT-180ATC PCB is a remarkable advancement in laminate technology, offering unmatched performance characteristics that cater to the needs of modern electronic applications. With its high Tg, excellent thermal properties, and robust construction, the IT-180ATC is poised to meet the challenges faced by engineers and designers across various industries.

As the electronic landscape continues to evolve, the IT-180ATC PCB stands ready to support innovation and reliability in high-demand environments. For more information on how the IT-180ATC can enhance your projects, please contact our sales team. We are dedicated to providing the highest quality products.