2-Layer Rogers TMM13i PCB 0.6mm Thick Immersion Gold Finish

This 2-layer Rogers TMM13i rigid PCB is a high-grade RF and microwave printed circuit board engineered for demanding high-frequency applications. Built with premium Rogers TMM13i isotropic thermoset ceramic polymer substrate material, the board features a standard finished thickness of 0.6mm and 1 oz (1.4 mils) outer-layer copper weight. It adopts immersion gold surface finishing for superior electrical conductivity and anti-oxidation capability, with 20 μm via plating thickness to ensure consistent and reliable circuit conduction. Equipped with 5/8 mil minimum line width/spacing and 0.25mm minimum hole size, the PCB utilizes a no blind-via structure, paired with top-side white silkscreen and double-sided solder mask-free configuration. Manufactured per IPC-Class-2 criteria and based on Gerber RS-274-X fabrication files, each board undergoes full 100% electrical testing prior to shipment, with global supply coverage for versatile high-frequency circuit deployment.

PCB Specification

This high-frequency PCB adopts a robust 2-layer rigid stack-up without blind vias, enabling high-yield, stable fabrication and optimal signal integrity for microwave circuits. The symmetrical layer structure delivers consistent electrical performance and minimal high-frequency signal attenuation.

PCB Stack-up Structure:

PCB Statistic

This high-performance TMM13i RF PCB features a well-optimized circuit layout for high-frequency signal transmission. It comes with precise component layout, pad distribution and via placement to support compact-size and high-precision assembly requirements.

Rogers TMM13i Substrate Introduction

Rogers TMM13i is a ceramic-filled hydrocarbon thermoset polymer composite microwave laminate, specifically designed for high-reliability plated thru-hole (PTH) stripline and microstrip applications.

It features an isotropic dielectric constant (Dk) with a thermal coefficient of dielectric constant of less than 30 ppm/°C, ensuring excellent electrical stability across a wide temperature range. The material exhibits isotropic coefficient of thermal expansion (CTE) that closely matches that of copper, significantly enhancing plated thru-hole reliability under thermal cycling. Low etch shrinkage enables high-precision circuit patterning. Its thermal conductivity is approximately twice that of conventional PTFE/ceramic laminates, providing superior heat dissipation.

Based on a thermoset resin system, TMM13i does not soften when heated, eliminating concerns of pad lifting or substrate deformation during wire bonding. Furthermore, it requires no sodium naphthalate pretreatment prior to electroless plating and can be processed using standard PCB fabrication equipment, combining excellent RF performance with manufacturing convenience.

Superior Electrical & Thermal Properties

TMM13i Material Benefits & Advantages

Outperforming standard FR4 and conventional microwave PCBs, this 2-layer TMM13i PCB delivers outstanding mechanical stability and fabrication compatibility, making it ideal for high-frequency and high-precision application scenarios.

Superior mechanical stability: Resists creep and cold flow, sustaining stable structural performance during long-term operation

Outstanding chemical resistance: Withstands common PCB processing chemicals and etchants, reducing substrate damage and boosting fabrication yield

Optimized plating workflow: Requires no sodium napthanate pre-treatment for electroless plating, shortening production cycles and cutting costs

Dependable wire bonding capability: Thermoset resin build prevents substrate deformation and pad lifting for precision packaging

Comprehensive quality assurance: 100% post-production electrical testing eliminates circuit defects for consistent reliability

High-performance immersion gold finish: Delivers superior solderability, conductivity and oxidation resistance for extended service life

Typical Applications

Thanks to its ultra-low signal loss, consistent dielectric stability and reliable thermal resistance, Rogers TMM13i high-frequency PCBs are widely adopted in high-precision RF and microwave industrial fields:

• Precision chip testing instruments & industrial testers
• Microwave dielectric polarizers and optical lenses
• RF filters, signal couplers and power divider components
• Custom high-frequency RF and microwave circuit modules
• High-precision communication and radar electronic assemblies

Quality & Service Guarantee

All TMM13i microwave PCBs are fabricated in strict accordance with IPC-Class-2 industrial quality specifications. Manufactured based on standard Gerber RS-274-X fabrication files, these PCBs deliver precise circuit patterning and exceptional dimensional consistency for reliable high-frequency circuit layouts. Every completed unit undergoes comprehensive electrical performance verification prior to shipment to eliminate functional defects and ensure consistent quality. With worldwide supply accessibility and professional technical support, these high-performance RF PCBs provide dependable solutions for industrial manufacturing and high-end R&D applications across global markets.