In the demanding world of RF and microwave electronics, signal integrity and material stability are paramount. Our 2-layer rigid PCB, constructed with Wangling's advanced F4BM220 PTFE/fiberglass laminate, delivers exceptional high-frequency performance for critical communication and radar systems. With its ultra-low loss characteristics and precise dielectric properties, this PCB is engineered to meet the rigorous demands of modern RF applications.

Precision Construction & Key Specifications

Base Material: High-performance F4BM220 PTFE/fiberglass composite for superior RF characteristics

Layer Count: 2 layers with 4/6 mil trace/space capability

Board Dimensions: 130.5mm × 103mm (±0.15mm tolerance)

Minimum Hole Size: 0.3mm (mechanical drilling)

Finished Thickness: 1.7mm (1.575mm core with 35μm copper layers)

Surface Finish: ENIG (Electroless Nickel Immersion Gold) for reliable solderability

Via Plating Thickness: 20μm for durable interconnects

Electrical Testing: 100% tested prior to shipment

Optimized Stackup for RF Performance
The 2-layer stackup is carefully engineered for maximum signal integrity:

Top Layer: 35μm ED copper foil

Core: 1.575mm F4BM220 laminate (PTFE/fiberglass composite)

Bottom Layer: 35μm ED copper foil

Special Design Considerations:

No solder mask or silkscreen to minimize dielectric interference

All vias are through-hole (no blind/buried vias)

Clean surface finish for optimal RF performance

Why Choose F4BM220 Material?
Superior High-Frequency Characteristics
 

Dielectric Constant (Dk): 2.2±0.04 @ 10GHz - exceptional stability for precise impedance control

Ultra-Low Loss: Dissipation Factor (Df) of 0.001 at 10GHz for minimal signal degradation

Thermal Stability: CTE of 25ppm/°C (x-axis), 34ppm/°C (y-axis) for dimensional reliability

Moisture Resistance: Absorption ≤0.08% for consistent performance in varied environments

Enhanced Reliability Features
UL-94 V0 flammability rating for safety compliance

Excellent temperature resistance (-55°C to 288°C operating range)

Thermal coefficient of Dk: -142ppm/°C (-55°C to 150°C) for stable performance

Ideal Applications
This PCB is specifically designed for high-frequency applications including:

Microwave and RF communication systems

Phase shifters and power dividers

Satellite communication equipment

Base station antennas and feed networks

Radar systems and phased array antennas

Couplers and combiners

Quality Assurance & Global Availability
We maintain strict quality standards to ensure reliable performance:

Compliant with IPC-Class-2 standards

Accepts Gerber RS-274-X artwork files

Worldwide availability with reliable shipping options