RT Duroid 5880 PCB 3 Layer 3.3mm Thick Immersion Gold Finish
This PCB is built using RT/duroid 5880 and RO4450F, both of which are renowned for their superior electrical properties.
- RT/duroid 5880 is a high-frequency laminate composed of PTFE (Polytetrafluoroethylene) reinforced with glass microfibers. Its dielectric constant remains uniform across various frequencies, making it ideal for applications that demand consistent performance.
- RO4450F is used as a bonding ply, providing additional strength and thermal stability to the PCB structure.
Key Specifications
- Dimensions: 49.1mm x 43.2mm (±0.15mm)
- Layer Count: 3 layers
- Minimum Trace/Space: 5/7 mils
- Minimum Hole Size: 0.4mm
- Finished Board Thickness: 3.3mm
- Finished Copper Weight: 1oz (1.4 mils) on both outer and inner layers
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Testing: 100% electrical testing is conducted prior to shipment to ensure quality and reliability.
Advantages of RT/duroid 5880
The use of RT/duroid 5880 offers numerous advantages:
- Uniform Electrical Properties: The dielectric constant of RT/duroid 5880 is tightly controlled, with a typical value of 2.2 (±0.02 at 10 GHz). This consistency is crucial for high-frequency applications.
- Low Dissipation Factor: At 10 GHz, the dissipation factor is an impressive 0.0009, minimizing signal loss and enhancing overall performance.
- Resistance to Environmental Factors: The material is resistant to solvents and reagents, making it suitable for various manufacturing processes.
- Thermal Stability: With a low temperature coefficient of dielectric constant (TCDk) of -125 ppm/°C, this PCB can maintain performance across a wide temperature range.
| RT/duroid 5880 Typical Value | ||||||
| Property | RT/duroid 5880 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.20 2.20±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.2 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0004 0.0009 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -125 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1070(156) | 450(65) | X | ||||
| 860(125) | 380(55) | Y | ||||
| Ultimate Stress | 29(4.2) | 20(2.9) | X | |||
| 27(3.9) | 18(2.6) | Y | ||||
| Ultimate Strain | 6 | 7.2 | X | % | ||
| 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 710(103) | 500(73) | X | MPa(kpsi) | A | ASTM D 695 |
| 710(103) | 500(73) | Y | ||||
| 940(136) | 670(97) | Z | ||||
| Ultimate Stress | 27(3.9) | 22(3.2) | X | |||
| 29(5.3) | 21(3.1) | Y | ||||
| 52(7.5) | 43(6.3) | Z | ||||
| Ultimate Strain | 8.5 | 8.4 | X | % | ||
| 7.7 | 7.8 | Y | ||||
| 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.2 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 31 48 237 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 31.2(5.5) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
Applications
The versatility of this 3-layer rigid PCB makes it suitable for a wide range of applications, including:
- Commercial Airline Broadband Antennas: High reliability and performance in communication systems.
- Microstrip and Stripline Circuits: Ideal for RF and microwave applications.
- Millimeter Wave Applications: Supports advanced technologies in telecommunications and radar.
- Radar Systems: Critical for guidance systems and precision tracking.
- Point-to-Point Digital Radio Antennas: Ensures clear and reliable connections in communication networks.
Quality Assurance and Standards
Our manufacturing process adheres to IPC-Class-2 standards, ensuring that each PCB meets the highest quality benchmarks. The use of Gerber RS-274-X artwork facilitates precise production, and the implementation of 100% electrical testing prior to shipment guarantees that only fully functional boards reach our customers.
Conclusion
RT duroid 5880 PCB stands as a testament to advanced engineering and quality manufacturing. With its exceptional electrical properties, robust construction, and versatility across various applications, this PCB is an ideal choice for engineers and designers aiming for excellence in their electronic projects. As technology continues to evolve, we remain committed to providing solutions that meet the ever-changing needs of the industry.
Get in Touch
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