Bicheng Electronics Technology Co., Ltd
                                                                                                           
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23 Years
Since 2003
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Rogers RO4350B PCB 16.6mil Double-Sided ENEPIG Finish

Price Negotiable
Price: USD9.99-99.99/PCS
MOQ: 1PCS
Delivery Time: 8-9 working days
Brand: Bicheng
Product Description

Meet our high-performance double-layer rigid PCB, expertly crafted using Rogers RO4350B material. It is designed for a variety of high-frequency and RF applications where reliable performance and cost-effectiveness are crucial, making it an excellent choice for cellular base stations, automotive radar, and more.

 

The stack-up of this PCB is carefully designed as follows:

 

Copper_layer_1: 35 μm

Rogers RO4350B Core: 0.422 mm (16.6mil)

Copper_layer_2: 35 μm

 

PCB Details

Parameter Specification
Base Material RO4350B
Layer Count Double sided
Board Dimensions 42.3 mm x 30.8 mm=1PCS, +/- 0.15mm
Minimum Trace/Space 4/5 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Board Thickness 0.5mm
Finished Cu Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Electroless Palladium Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No
Electrical Testing 100% tested prior to shipment

 

What Makes RO4350B Material Stand Out?

 

Material Composition & Performance Balance

Rogers RO4350B materials are proprietary woven glass reinforced hydrocarbon/ceramics. They strike a unique balance: electrical performance close to PTFE/woven glass, while maintaining the manufacturability of epoxy/glass.

 

Processing & Cost Advantages

RO4350B laminates provide tight control on dielectric constant (Dk) and maintain low loss, all while using the same processing methods as standard epoxy/glass. They are available at a fraction of the cost of conventional microwave laminates and eliminate the need for special through-hole treatments or handling procedures required by PTFE-based materials. Plus, they’re UL 94 V-0 rated, making them suitable for active devices and high-power RF designs.

 

Thermal Stability Benefits

RO4350B’s thermal coefficient of expansion (CTE) offers key advantages:

 

Its expansion coefficient is similar to copper, ensuring excellent dimensional stability—critical for mixed dielectric multi-layer board constructions.

 

The low Z-axis CTE guarantees reliable plated through-hole quality, even in severe thermal shock applications.

 

With a Tg of >280°C (536°F), its expansion characteristics stay stable across the entire range of circuit processing temperatures.

 

 

Key Features

-Dielectric Constant of DK 3.48 +/-0.05 at 10GHz/23°C

-Dissipation Factor of 0.0037 at 10GHz/23°C

-Thermal Conductivity 0.69 W/m/°K

-X axis CTE of 10 ppm/°C, Y CTE of 12 ppm/°C, Z CTE of 32 ppm/°C

-High Tg value of >280 °C

-Low water absorption of 0.06%

-UL 94 V-0 rated

 

Benefits

-Ideal for multi-layer board (MLB) constructions

-Processes like FR-4 at lower fabrication cost

-Excellent dimensional stability

-Competitively priced

 

Where Can It Be Used?

The unique properties of RO4350B make this PCB suitable for a range of applications:

 

-Cellular Base Station Antennas and Power Amplifiers

-RF Identification Tags

-Automotive Radar and Sensors

-LNB's for Direct Broadcast Satellites

-Compliance & Availability

 

This PCB meets strict IPC-Class-2 standards, ensuring consistent quality and reliability. The type of artwork supplied is Gerber RS-274-X for seamless production integration.

 

We offer worldwide availability, making this high-quality PCB accessible to engineers and manufacturers across all regions.

 

Choose this PCB for a solution that delivers on both quality and value.

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact Person Ivy Deng

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