This high-performance 2-layer rigid PCB is crafted from TSM-DS3, a ceramic-filled reinforced material boasting an ultra-low fiberglass content of approximately 5%. Tailored for high-power, high-frequency, and thermally challenging applications, it capitalizes on TSM-DS3's remarkable thermal conductivity, low dielectric loss, and dimensional stability.

The 2-layer stack-up is engineered to maximize TSM-DS3's thermal and electrical performance, with a simplified structure tailored to high-power, high-frequency needs:

TSM-DS3 is a ceramic-filled reinforced material designed to bridge the gap between high-performance low-loss laminates and epoxy-based materials, with key distinguishing traits:

Composition: Ceramic fillers with ultra-low fiberglass content (~5%), enabling both low dielectric loss and dimensional stability that rivals epoxies.

Core Strengths: Thermally stable (TC=0.65 W/m*K) for high-power heat management, and low thermal expansion (matched to copper CTE) for demanding thermal cycling--critical for applications like oil drilling and semiconductor ATE testing.

Manufacturability: Compatible with standard PCB fabrication processes, supporting large-format, high-layer-count designs with the consistency and yield of fiberglass-reinforced epoxies, despite its low fiberglass content.

TSM-DS3 delivers targeted performance features that define the PCB's suitability for high-power, high-frequency applications:

• Precise Dielectric Constant: Dk=3.0±0.05 at 10GHz/23°C, ensuring minimal impedance variation across the board--essential for phased array antennas and couplers that require tight phase matching.
• Ultra-Low Dissipation Factor: 0.0014 at 10GHz, minimizing signal attenuation in high-frequency paths, preserving power efficiency in radar manifolds and mmWave antennas.
• High Thermal Conductivity: 0.65 W/MK (unclad), enabling efficient heat dissipation from high-power components (e.g., RF amplifiers) to prevent overheating and performance degradation.
• Low Moisture Absorption: 0.07%, preventing dielectric degradation and Dk drift in humid or harsh environments (e.g., oil drilling equipment, outdoor radar systems).
• Copper-Matched CTE: X-axis=10 ppm/°C, Y-axis=16 ppm/°C, Z-axis=23 ppm/°C, reducing thermal stress between copper layers and the substrate during thermal cycling--critical for long-term reliability in automotive and aerospace applications.

The features of TSM-DS3 translate to tangible advantages for PCB design, manufacturing, and application performance:

• Low Fiberglass Content (~5%): Reduces dielectric discontinuities compared to traditional fiberglass-reinforced materials, improving high-frequency signal integrity.
• Epoxy-Rivaling Dimensional Stability: Enables large-format PCB fabrication (e.g., 68mm×126mm size of this PCB) without warpage, supporting complex component layouts.
• Large-Format, High-Layer-Count Compatibility: Facilitates scaling to multi-layer designs while maintaining yield and consistency--ideal for future iterations of high-power systems.
• Stable Dk Across Temperature: ±0.25% Dk variation from -30°C to 120°C, ensuring consistent performance in extreme operating environments (e.g., automotive mmWave radar, oil drilling electronics).
• Resistive Foil Compatibility: Supports integration of resistive foils for embedded passive components, simplifying design and reducing component count in compact systems.

Artwork Format: Gerber RS-274-X, the industry-standard format for PCB fabrication, ensuring compatibility with global manufacturing equipment.

Accepted Standard: IPC-Class-2 compliance, guaranteeing reliable performance for commercial and industrial high-power/high-frequency applications with strict controls for trace accuracy, hole precision, and electrical continuity.

Processing Compatibility: TSM-DS3's manufacturability (consistent with epoxy processes) eliminates the need for specialized equipment, reducing production costs and lead times.

• Couplers
• Phased Array Antennas
• Radar Manifolds
• mmWave Antenna/Automotive
• Oil Drilling
• Semiconductor/ATE Testing

This PCB is available for worldwide shipping, supporting global project requirements.

This 2-layer TSM-DS3 PCB combines the material's unique ceramic-filled, low-fiberglass composition (low loss, high thermal conductivity) with precision manufacturing to address the demands of high-power, high-frequency applications.