6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias
Price:
USD9.99-99.99
MOQ:
1PCS
Delivery Time:
8-9 working days
Brand:
Bicheng
Product Description
6-Layer Hybrid PCB RO4350B + High Tg FR-4 (S1000-2M) Blind Vias
This 6-layer hybrid PCB combines Rogers RO4350B (high-frequency laminate) and High Tg FR-4 (S1000-2M) to optimize performance for high-frequency, mission-critical applications.
PCB Specification
| Construction Parameter | Specification |
|---|---|
| Base Material | RO4350B + High Tg FR-4 (S1000-2M) |
| Layer Count | 6-layer |
| Board Dimensions | 30.55mm x 37.7mm (1 piece) with tolerance of ±0.15mm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.25mm |
| Vias (Special Types) | Blind vias (L1-L2) |
| Finished Board Thickness | 1.3mm |
| Finished Copper Weight (Inner/Outer Layers) | 1oz (1.4 mils) |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) |
| Top Silkscreen | White |
| Bottom Silkscreen | White |
| Top Solder Mask | No |
| Bottom Solder Mask | Green |
| Quality Assurance (Electrical Testing) | 100% Electrical test performed prior to shipment |
Hybrid PCB Stack-up
| Layer Sequence | Layer Type | Specification | Thickness |
|---|---|---|---|
| 1 | Copper Layer (Top) | Copper_layer_1 | 35 μm |
| 2 | Laminate | RO4350B | 0.102mm (4mil) |
| 3 | Copper Layer | Copper_layer_2 | 35 μm |
| 4 | Prepreg | 1080 RC63% + 7628 (43%) | 0.254mm (10mil) |
| 5 | Copper Layer | Copper_layer_3 | 35 μm |
| 6 | Core Material | S1000-2M | 0.254mm (10mil) |
| 7 | Copper Layer | Copper_layer_4 | 35 μm |
| 8 | Prepreg | 1080 RC63% + 7628 (43%) | 0.254mm (10mil) |
| 9 | Copper Layer | Copper_layer_5 | 35 μm |
| 10 | Core Material | S1000-2M | 0.254mm (10mil) |
| 11 | Copper Layer (Bottom) | Copper_layer_6 | 35 μm |
What is a Hybrid PCB?
A hybrid PCB (also known as a mixed-material PCB) is a specialized circuit board that integrates two or more distinct base materials in its stack-up, each selected to optimize specific performance attributes. Unlike single-material PCBs, which must compromise on certain properties, hybrid PCBs leverage the strengths of each material to address diverse design requirements.
Rogers RO4350B Material Overview
Rogers RO4350B is a proprietary laminate composed of woven glass reinforcement blended with hydrocarbon/ceramic compounds, striking a balance between PTFE/woven glass-like electrical performance and the manufacturing simplicity of epoxy/glass materials.
Tailored for high-frequency applications, RO4350B laminates offer tightly controlled dielectric constant (Dk) and maintain ultra-low signal loss--all while being processable using standard epoxy/glass manufacturing workflows. A cost-effective alternative to traditional microwave laminates, RO4350B eliminates the need for specialized through-hole treatments or handling procedures required by PTFE-based materials. It also holds a UL 94 V-0 flammability rating, making it suitable for active electronic devices and high-power RF designs.
RO4350B Properties
| Property | Specification |
|---|---|
| Material Type | Proprietary woven glass reinforced hydrocarbon/ceramic laminate |
| Dielectric Constant (Dk) | 3.48 ±0.05 (measured at 10GHz/23°C) |
| Dissipation Factor (Df) | 0.0037 (measured at 10GHz/23°C) |
| Thermal Conductivity | 0.69 W/m/°K |
| Coefficient of Thermal Expansion (CTE) | X-axis: 10 ppm/°C Y-axis: 12 ppm/°C Z-axis: 32 ppm/°C |
| Glass Transition Temperature (Tg) | >280°C (536°F) |
| Moisture Absorption | 0.06% (max) |
| Flammability Rating | UL 94 V-0 |
Core Features (S1000-2M High Tg FR-4)
- Reduced Z-axis CTE, enhancing through-hole reliability in demanding environments
- Superior mechanical processability paired with exceptional thermal resistance
- Lead-free soldering compatibility, aligning with modern manufacturing standards
- Glass Transition Temperature (Tg): 180°C (per DSC testing); UV-blocking properties for AOI compatibility
- Outstanding high-heat endurance for stable performance in elevated temperature conditions
- Excellent Anti-CAF (Conductive Anodic Filtration) performance, mitigating long-term reliability risks
- Minimal moisture absorption, ensuring durability in humid operating environments
Typical Applications
- Commercial Airline Broadband Antennas
- Microstrip and Stripline Circuits
- Millimeter Wave Systems
- Radar & Guidance Systems
- Point-to-Point Digital Radio Antennas
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Company
Bicheng Electronics Technology Co., Ltd
Location
6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact Person
Ivy Deng