Double-Sided WL-CT440 PCB 10mil Substrate Green Solder Mask
This PCB utilizes WL-CT440 as its base material, incorporates an Immersion Gold surface finish, and strictly adheres to IPC-Class-2 quality specifications. Configured as a 2-layer rigid structure with a 0.254mm (10 mil) WL-CT440 substrate core, it is tailored to meet the high-frequency, low-loss performance requirements of aerospace, radar, and satellite communication systems.
PCB Specifications
| Construction Parameter | Specification |
| Base Material | WL-CT440 (hydrocarbon resin-ceramic-fiberglass cloth composite, thermosetting high-frequency material) |
| Layer Count | 2-layer rigid configuration |
| Board Dimensions | 56.5mm × 89.65mm per unit, with a dimensional tolerance of ±0.15mm |
| Minimum Trace/Space | Minimum trace width of 6 mils and spacing of 7 mils |
| Minimum Hole Size | 0.35mm |
| Blind Vias | Not utilized |
| Finished Board Thickness | 0.3mm |
| Finished Copper Weight | 1oz (1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion Gold |
| Silkscreen | White silkscreen applied to the top layer |
|
Solder Mask
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Green solder mask on the top layer |
| Quality Control | 100% electrical testing conducted prior to shipment |
Stack-up Configuration
| Layer Name | Material | Thickness |
| Top Copper Layer (Copper_layer_1) | Copper | 35 μm |
| Substrate Core | WL-CT440 | 0.254mm (10 mil) |
| Bottom Copper Layer (Copper_layer_2) | Copper | 35 μm |
WL-CT440 Material Introduction
Wangling's WL-CT440 is a thermosetting resin-based high-frequency copper-clad laminate (CCL) with organic polymer ceramic fiberglass cloth reinforcement. Its dielectric layer comprises hydrocarbon resin, ceramic fillers, and fiberglass cloth, delivering low-loss performance that meets rigorous high-frequency design criteria. WL-CT440 is process-compatible with standard FR4 manufacturing techniques, offering simplified processing compared to PTFE-based materials while ensuring enhanced circuit stability and consistency. It serves as a high-performance alternative to equivalent foreign materials.
The synergistic combination of hydrocarbon resin and composite ceramics imparts WL-CT440 with exceptional low-loss characteristics, high-temperature resistance, and thermal stability. This material series features stable temperature coefficients of dielectric constant (TCDK) and dielectric loss, a low coefficient of thermal expansion (CTE), and a glass transition temperature (Tg) exceeding 280°C, rendering it well-suited for high-frequency applications in harsh operating environments.
WL-CT440 Material Features
| Category | Feature | Specification |
| Electrical Properties | Dielectric Constant (Dk) | 4.1 at 10GHz/23°C |
| Dissipation Factor | 0.005 at 10GHz | |
| Thermal Performance | Glass Transition Temperature (Tg) | 280°C |
| TCDK | -21 ppm/°C | |
| Thermal Conductivity | 0.66 W/mK | |
| CTE (XYZ Axes) | 14/18/35 ppm/°C (matched to copper) | |
| Physical Properties | Moisture Absorption | 0.12% |
| Flammability Rating | UL 94-V0 |
WL-CT440 Material Benefits
-Superior Low-Loss Performance: The hydrocarbon resin and composite ceramic formulation delivers a low dissipation factor, critical for high-fidelity high-frequency signal transmission.
-FR4-Process Compatible: Compatible with standard FR4 manufacturing workflows, simplifying production compared to PTFE materials while ensuring consistent circuit performance.
-Exceptional Thermal Stability: A high Tg (280°C) and stable TCDK ensure reliable operation in extreme temperature environments.
-Copper-Matched CTE: Thermal expansion coefficient aligned with copper minimizes thermal stress, enhancing long-term structural and electrical reliability.
Typical Applications
-Aerospace Equipment
-Microwave & Antenna Systems
-beamforming networks
-Radar Systems
-Satellite & Navigation
-Power Amplifiers
Quality & Availability
This PCB adheres to IPC-Class-2 quality standards, ensuring consistent reliability for aerospace, military, and high-frequency electronic systems. It is available for worldwide, supporting global project needs and ensuring timely delivery.
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