TMM10 PCB Rogers Laminate 15mil Thick EPIG Nickel-Free Finish
This PCB adopts Rogers TMM10 as its base material, features a nickel-free Electroless Palladium Immersion Gold (EPIG) surface finish, and strictly conforms to IPC-Class-2 quality standards. With a double-sided rigid structure, it is engineered to fulfill the high-reliability demands of RF, microwave, and precision electronic applications, while the EPIG finish ensures superior corrosion resistance, solderability, and compatibility with precision assembly processes.
PCB Specifications
| Construction Parameter | Specification |
| Base Material | Rogers TMM10 (thermoset microwave material) |
| Layer Count | Double-sided (2-layer rigid structure) |
| Board Dimensions | 85mm × 120mm per unit, with a tolerance of ±0.15mm |
| Minimum Trace/Space | Minimum 5 mils (trace) and 7 mils (space) |
| Minimum Hole Size | 0.4mm |
| Blind Vias | Not used |
| Finished Board Thickness | 0.5mm |
| Finished Copper Weight | 1oz (1.4 mils) on both outer layers |
| Via Plating Thickness | 20 μm, ensuring reliable via conductivity |
| Surface Finish | Electroless Palladium Immersion Gold (EPIG, nickel-free) |
| Silkscreen | White silkscreen on the top layer; no silkscreen on the bottom layer |
| Solder Mask | Green solder mask on the top layer; no solder mask on the bottom layer |
| Quality Control | 100% electrical testing conducted prior to shipment |
Stack-up Configuration
| Layer | Specification | Function |
| Copper Layer 1 | 35 μm (1oz) thickness | Top signal layer, equipped with white silkscreen and green solder mask |
| Rogers TMM10 Core | 0.381mm (15mil) thickness | Low-loss dielectric core layer |
| Copper Layer 2 | 35 μm (1oz) thickness | Bottom signal layer, without silkscreen or solder mask |
Rogers TMM10 Material Introduction
Rogers TMM10 is a high-performance thermoset microwave material that combines the advantages of both PTFE and ceramic-based substrates. Unlike conventional materials, it is not restricted by the same mechanical limitations and production process constraints, rendering it highly versatile for various high-frequency applications.
TMM10 Material Features
| Property Type | Property | Specification |
| Electrical Properties | Dielectric Constant (Dk) | 9.20 ± 0.230 |
| Dissipation Factor | 0.0022 at 10GHz | |
| Thermal Coefficient of Dk | -38 ppm/°K | |
| Thermal & Physical Properties | Decomposition Temperature (Td) | 425°C (TGA analysis) |
| Thermal Conductivity | 0.76 W/mK | |
| Coefficient of Thermal Expansion (CTE) | X/Y/Z: 21/21/20 ppm/K | |
| Thickness Range | 0.0015-0.500 inches, tolerance ±0.0015 inches |
TMM10 Material Benefits
-Superior Mechanical Stability: TMM10 possesses excellent mechanical properties, resisting creep and cold flow to maintain long-term dimensional stability even in harsh operating environments.
-Process Chemical Resistance: The material exhibits high resistance to process chemicals, effectively minimizing damage during etching, plating, and other PCB fabrication processes.
-Simplified Plating Process: It eliminates the need for sodium naphthanate treatment prior to electroless plating, streamlining manufacturing workflows and shortening production cycles.
-Reliable Wire-Bonding Capability: As a thermoset resin-based material, TMM10 enables reliable wire-bonding, a critical requirement for high-frequency and precision electronic assemblies.
Typical Applications
-Chip Testers
-Dielectric Polarizers
-Satellite Communication Systems
-GPS Antennas
-Patch Antennas
Quality & Availability
This PCB strictly adheres to IPC-Class-2 quality standards, thereby ensuring consistent performance. It is available for worldwide, supporting global project requirements and facilitating timely delivery to international clients.
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