3mm No Silkscreen PTFE PCB Board Hot Air Soldering
Hello everybody,
Today we talk about a type of F4B high frequency circuit board at 3.0mm thick.
The F4B series of high frequency materials predominantly comprises PTFE glass fiber cloth and ceramic-filled PTFE glass fiber cloth. This series is a cost-effective choice while also being dependable due to its consistent quality. It finds its use in various modern applications such as navigation, satellite communication, radar, and the latest technologies like 4G and 5G communications.
| PCB Specifications | |
| Layer count: | Double sided |
| Base material: | F4B DK 2.2 |
| Dimension: | 25 x 26mm |
| Finished thickness | 3.0mm ±10% |
| Finished Copper weight: | 1oz |
| SMOBC: | No |
| Surface finish: | HASL Pb free |
The main specifications of this board is double sided board, substrate is F4B, DK at 2.2, 61mm long by 62mm wide, finished thickness at 3.0mm, finished copper at 1.0oz, no solder mask no silkscreen and surface finish is OSP.
Let’s see the stack up.
Top layer and bottom layer are 1oz copper finished. F4b dielectric material is in the middle of 2 layers copper, showing dielectric constant at 2.2, 3.0mm thick.
This is the photo of this board. The basic colour of F4B PCB is brown.
| PCB Capability | |
| PCB Material: | PTFE |
| Code: | F4B series |
| Dielectric constant: | 2.2, 2.55 and 2.65 |
| 2.17, 2.45, 2.75 and 3.0 | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type |
| Copper weight: | 0.5oz, 1oz, 2oz, 3oz |
| PCB thickness: | 0.17mm, 0.25mm, 0.5mm, 0.8mm, 1.0mm, |
| 1.5mm, 2.0mm, 3.0mm, 4.0mm and 5.0mm, etc. | |
| PCB Size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
The dielectric constant of F4B material is wide, ranging 2.2 to 3.0 etc. Board thickness ranges 0.17mm to 5.0mm. We can provide you with prototype service, small batches and mass production service.
Should you have any questions, please feel free to contact us.
Thank you for your reading.
Appendix: Data Sheet PTFE(F4B)
| Name | Test condition | Unit | Value | |||
| Density | Normal state | g/ cm3 | 2.1～2.35 | |||
| Moisture Absorption | Dip in the distilled water of 20±2℃ for 24 hours | % | ≤0.02 | |||
| Operating Temperature | High-low temperature chamber | ℃ | -50℃～+260℃ | |||
| Thermal Conductivity | W/m/k | 0.8 | ||||
| CTE (typical) | 0～100℃ (εr :2.1~2.3) | ppm/℃ | 25(x) | |||
| 34(y) | ||||||
| 252(z) | ||||||
| CTE (typical) | 0～100℃ (εr :2.3~2.9) | ppm/℃ | 14(x) | |||
| 21(y) | ||||||
| 173(z) | ||||||
| CTE (typical) | 0～100℃ (εr :2.9~3.5) | ppm/℃ | 12(x) | |||
| 15(y) | ||||||
| 95(z) | ||||||
| Shrinkage Factor | 2 hours in boiling water | % | 0.0002 | |||
| Surface Resistivity | 500V DC | Normal state | M·Ω | ≥1×104 | ||
| Constant humidity and temperature | ≥1×103 | |||||
| Volume Resistivity | Normal state | MΩ.cm | ≥1×106 | |||
| Constant humidity and temperature | ≥1×105 | |||||
| Pin Resistance | 500V DC | Normal state | MΩ | ≥1×105 | ||
| Constant humidity and temperature | ≥1×103 | |||||
| Surface dielectric strength | Normal state | d=1mm(Kv/mm) | ≥1.2 | |||
| Constant humidity and temperature | ≥1.1 | |||||
| Dielectric Constant | 10GHZ | εr | 2.20,2.55,2.65,3.0,3.5 (±2%) | |||
| Dissipation Factor | 10GHZ | tgδ | 2.2 | ≤7×10-4 | ||
| 2.55~2.65 | ≤1×10-3 | |||||
| 3.0~3.5 | ≤1.5×10-3 | |||||
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