Double-Sided CER-10 High-Frequency PCB 30mil Laminate Immersion Silver
This is a customized 2-layer rigid high-frequency PCB utilizing Taconic CER-10 organic-ceramic laminate, engineered for high-performance microwave and RF circuit applications. The board features immersion silver surface plating with double-sided silkscreen-free and solder mask-free construction. Each unit is fully electrically tested prior to delivery to guarantee consistent and dependable performance.
PCB Specification
| Parameter Item | Specification |
| Base Material | Taconic CER-10 organic-ceramic high-frequency laminate |
| Layer Count | 2 layers rigid PCB |
| Board Dimensions | 67mm × 55.9mm (1 piece) |
| Minimum Trace / Space | 5 mils / 6 mils |
| Minimum Mechanical Hole Size | 0.4mm |
| Via Type | Only through-hole vias are applied; no blind vias are designed |
| Finished Board Thickness | 0.85mm |
| Outer Layer Finished Copper Weight | 1oz (1.4 mils) for outer copper layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Silkscreen Layer | Free of silkscreen on both top and bottom sides |
| Solder Mask Layer | Adopts a double-sided solder mask-free structure |
| Quality Test | 100% electrical testing performed prior to shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top Layer) | 35μm finished copper thickness |
| Dielectric Core | Taconic CER-10 organic-ceramic substrate, 0.762mm (30mil) thickness |
| Copper Layer 2 (Bottom Layer) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Fabricated based on standard Gerber RS-274-X data to ensure precise circuit patterning and complete manufacturing compatibility.
Quality Standard: All production and inspection processes comply with IPC-Class-2 criteria, ensuring stable electrical performance and long-term durability for commercial and industrial applications.
Service Coverage: Global shipping is supported to provide steady and reliable product supply for international high-frequency PCB projects.
CER-10 Material Overview
CER-10 is a high-performance organic-ceramic laminate belonging to Taconic’s ORCER product series. It integrates woven glass reinforcement, advanced ceramic filling technology and professional coated PTFE fiberglass craftsmanship, achieving a balanced combination of stable electrical performance and solid mechanical properties. Featuring a fixed dielectric constant of 10 and an ultra-low dissipation factor of 0.0035 at 10 GHz, this material delivers outstanding low-loss high-frequency performance. It also provides excellent interlaminar bonding strength and superior solder resistance, making it a reliable choice for demanding high-frequency microwave circuit applications.
Core Material Performance Features & Benefits
High-Dk Low-Loss Characteristic: Features a stable DK of 10 and ultra-low DF of 0.0035 at 10GHz, reducing signal attenuation and phase shift for precise high-frequency transmission.
Superior Structural & Solder Resistance: Strong interlayer adhesion and solder resistance avoid delamination and structural damage, improving PCB stability and service reliability.
Ultra-Low Moisture Absorption: With 0.02% low moisture absorption, it maintains steady dielectric and electrical performance in humid and complex working environments.
Optimized Thermal Expansion Performance: Tuned CTE values lower Z-axis thermal expansion, protecting plated vias from thermal stress and ensuring stable connectivity.
Dimensional & Mechanical Stability: High rigidity and flexural strength resist thermal and mechanical deformation, supporting high-precision fabrication and higher yield.
Miniaturization Support: High dielectric constant enables compact circuit layouts, minimizing PCB size and supporting lightweight microwave device design.
Typical Application Scenarios
Benefiting from its high dielectric constant, ultra-low high-frequency loss, stable mechanical structure and excellent environmental adaptability, CER-10-based PCBs are widely used in high-performance microwave and RF systems, mainly covering the following application fields:
- High-frequency power amplifiers
- Waveguide filter devices
- RF directional couplers
- Various high-performance microwave passive components
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