Double-sided TP440 PCB on 0.5mm Substrate with Immersion Gold
This is a custom 2-layer rigid high-frequency PCB built with Wangling TP440 thermoplastic dielectric material, engineered for high-stability radio frequency and miniature antenna applications. It adopts immersion gold surface finish with no solder mask and silkscreen on both sides.
PCB Specification
| Parameter Item | Specification |
| Board Dimensions | 67.5mm × 58.6mm (1 piece), dimensional tolerance: ±0.15mm |
| Minimum Trace / Space | 6 mils / 8 mils |
| Minimum Mechanical Hole Size | 0.3mm |
| Via Type | No blind vias adopted; only through-hole vias are used |
| Finished Board Thickness | 0.6mm |
| Outer Layer Finished Copper Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Gold |
| Silkscreen Layer | No top and bottom silkscreen |
| Solder Mask Layer | No top and bottom solder mask |
| Quality Test | 100% full electrical continuity and insulation test implemented before shipment |
PCB Layer Stack-up Structure
| Layer Name | Specification |
| Copper Layer 1 (Top Layer) | 35μm finished copper thickness |
| Dielectric Core | Wangling TP440 thermoplastic material, 0.5mm thickness |
| Copper Layer 2 (Bottom Layer) | 35μm finished copper thickness |
Artwork & Quality Standards
Artwork Format: Adopts standard Gerber RS-274-X format, the universal industry standard for PCB manufacturing.
Quality Compliance Standard: Fully compliant with IPC-Class-2 industrial reliability standard, the mainstream specification for commercial and industrial electronic products.
Supply Availability: Supports global delivery and professional technical after-sales service worldwide. With standardized production processes and complete quality inspection systems, it can stably deliver qualified TP440 high-frequency PCB products to customers in various regions.
Wangling TP440 Material Overview
Wangling TP series is an industry-exclusive high-frequency thermoplastic dielectric material. Different from traditional FR4 and conventional high-frequency substrates, TP-type laminates adopt a composite structure of ceramic powder and Polyphenylene Oxide (PPO) resin, with no fiberglass reinforcement inside the dielectric layer. The dielectric constant can be precisely and flexibly adjusted by modifying the mixing ratio of ceramic filler and PPO resin. With specialized production technology, this material delivers outstanding high-frequency dielectric performance and long-term working reliability.
Material grading definition: TP refers to non-copper-clad smooth dielectric substrate; TP-1 represents single-sided copper-clad material; TP-2 represents double-sided copper-clad material. The substrate used in this PCB is double-sided copper-clad TP440 material, which is a mature and mainstream model of Wangling TP series high-frequency substrates.
Core Material Performance Features
Tunable & Stable Dielectric Performance
TP440 features adjustable DK (3.0–25) with optional standard values. It has ultra-low, frequency-stable dielectric loss with minimal variation under 10GHz, suitable for high-frequency microwave circuits.
Wide Temperature Resistance
It ensures stable long-term operation at -100°C to +150°C with superior low-temperature resistance. Over 180°C, it may deform, suffer copper peeling and electrical performance degradation.
Flexible Customization & Superior Machinability
The material supports customized thickness starting from 0.5mm. It provides better copper adhesion than ceramic substrates and enables diverse machining processes including drilling, grinding and etching.
Excellent Environmental Adaptability
It features outstanding radiation resistance and low outgassing, delivering stable performance for harsh and high-reliability scenarios such as aerospace and weapon systems.
Typical Application Scenarios
Benefiting from stable high-frequency performance, ultra-wide temperature adaptability, miniaturization compatibility and excellent machinability, this TP440 PCB is widely applicable to high-precision miniature antenna and special radio frequency signal transmission fields, including:
-GPS antenna systems
-Beidou navigation antenna equipment
-Missile-borne microwave signal modules
-Fuze precision induction circuits
-Various miniaturized high-frequency antennas

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