2-layer Taconic TLX-8 PCB 1.3mm with ENIG RF Microwave Circuit Board
Crafted with premium Taconic TLX-8 PTFE fiberglass laminate, this custom 2-layer rigid PCB is purpose-built to deliver dependable, high-performance operation across demanding RF and microwave scenarios. Sporting a 1.3mm overall thickness and a compact 45mm × 66.04mm footprint with a strict ±0.15mm dimensional tolerance, the board adopts a pure ENIG surface treatment with no solder mask or silkscreen applied on either side. Engineered with exclusive through-hole structures and zero blind vias, it supports precise 6/9 mil trace/space routing and 0.4mm minimum drilling size. Every unit undergoes comprehensive 100% electrical testing prior to delivery, adheres to IPC-Class-2 quality benchmarks, and is available for reliable worldwide supply.
PCB Specifications
Tailored for low-layer microwave circuit design, this TLX-8 PCB balances precise fabrication precision and robust environmental adaptability. Every structural parameter follows standardized industrial specifications to sustain stable electrical transmission and mechanical durability in high-frequency working scenarios.
| Specification Item | Parameter Details |
| Base Material | Taconic TLX-8 PTFE fiberglass laminate |
| Layer Configuration | 2-layer rigid PCB |
| Board Dimensions | 45mm × 66.04mm (±0.15mm tolerance, 1PCS) |
| Minimum Trace / Space | 6/9 mils |
| Minimum Hole Size | 0.4mm |
| Via Type | Through-hole only, no blind vias |
| Finished Board Thickness | 1.3mm |
| Outer Copper Weight | 1oz (1.4 mils) |
| Via Plating Thickness | 20μm |
| Surface Finish | ENIG |
| Silkscreen | Top: None, Bottom: None |
| Solder Mask | Top: None, Bottom: None |
| Pre-Shipment Test | 100% electrical test prior to shipment |
PCB Stack-up Structure
Built with a fully symmetrical 2-layer stackup, this PCB centers on a 1.27mm (50mil) thick Taconic TLX-8 core substrate. Matching 35μm copper layers cover both top and bottom sides of the core, forming a balanced structural layout that minimizes signal deviation and delivers consistent mechanical and electrical performance for low-layer microwave designs.
| Layer Structure | Material & Thickness |
| Copper_layer_1 | 35 μm |
| TLX-8 Core | 1.27 mm (50mil) |
| Copper_layer_2 | 35 μm |
PCB Statistic
Optimized for compact RF circuit assembly and small-batch prototyping, the board features a reasonable layout of components, pads and vias to fit diverse microwave circuit design needs.
| Statistical Item | Quantity |
| Components | 13 |
| Total Pads | 26 |
| Thru Hole Pads | 12 |
| Top SMT Pads | 14 |
| Bottom SMT Pads | 0 |
| Vias | 8 |
| Nets | 2 |
TLX-8 Material Overview
As a high-volume, application-centric PTFE fiberglass laminate, Taconic TLX-8 has earned wide recognition for reliable performance across the full spectrum of RF applications. Its flexible customizable thickness and copper cladding options make it an ideal choice for simplified low-layer microwave designs. More importantly, this material delivers exceptional mechanical reinforcement, enabling end circuits to withstand extreme and harsh operating environments—from high-vibration space launch conditions and high-temperature engine module exposure, to space radiation, severe marine scenarios for shipboard antennas, and wide temperature fluctuations faced by flight altimeter substrates.
TLX-8 Properties
| TLX-8 TYPICAL VALUES | |||||
| Property | Test Method | Unit | Value | Unit | Value |
| DK @10 GHz | IPC-650 2.5.5.3 | 2.55 | 2.55 | ||
| Df @1.9 GHz | IPC-650 2.5.5.5.1 | 0.0012 | 0.0012 | ||
| Df @10 GHz | IPC-650 2.5.5.5.1 | 0.0017 | 0.0017 | ||
| Dielectric Breakdown | IPC-650 2.5.6 | kV | >45 | kV | >45 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.02 | % | 0.02 |
| Flexural Strength(MD) | ASTM D 709 | psi | 28,900 | N/mm2 | |
| Flexural Strength(CD) | ASTM D 709 | psi | 20,600 | N/mm2 | |
| Tensile Strength(MD) | ASTM D 902 | psi | 35,600 | N/mm2 | |
| Tensile Strength(CD) | ASTM D 902 | psi | 27,500 | N/mm2 | |
| Elongation at Break(MD) | ASTM D 902 | % | 3.94 | % | 3.94 |
| Elongation at Break(CD) | ASTM D 902 | % | 3.92 | % | 3.92 |
| Young's Modulus(MD) | ASTM D 902 | kpsi | 980 | N/mm2 | |
| Young's Modulus(CD) | ASTM D 902 | kpsi | 1,200 | N/mm2 | |
| Young's Modulus(MD) | ASTM D 3039 | kpsi | 1,630 | N/mm2 | |
| Poisson's Ratio | ASTM D 3039 | 0.135 | N/mm | ||
| Peel Stength(1 oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 15 | N/mm | |
| Peel Stength(1 oz.RTF) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 17 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8.3(Elevated Temp.) | Ibs./linear inch | 14 | N/mm | |
| Peel Stength(½ oz.ed) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 11 | N/mm | |
| Peel Stength(1 oz.rolled) | IPC-650 2.4.8 Sec.5.2.2(Thermal Stress.) | Ibs./linear inch | 13 | N/mm | 2.1 |
| Thermal Conductivity | ASTM F433/ASTM 1530-06 | W/M*K | 0.19 | W/M*K | 0.19 |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(After Bake.) | mils/in. | 0.06 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.4(After Bake.) | mils/in. | 0.08 | mm/M | |
| Dimensional Stability(MD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.09 | mm/M | |
| Dimensional Stability(CD) | IPC-650 2.4.39 Sec.5.5(Thermal Stress.) | mils/in. | 0.1 | mm/M | |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm | 6.605 x 108 | Mohm | 6.605 x 108 |
| Surface Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm | 3.550 x 106 | Mohm | 3.550 x 106 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Elevated Temp.) | Mohm/cm | 1.110 x 1010 | Mohm/cm | 1.110 x 1010 |
| Volume Resistivity | IPC-650 2.5.17.1 Sec.5.2.1(Humidity Cond.) | Mohm/cm | 1.046 x 1010 | Mohm/cm | 1.046 x 1010 |
| CTE(X axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 21 | ppm/℃ | 21 |
| CTE(Y axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 23 | ppm/℃ | 23 |
| CTE(Z axis)(25-260℃) | IPC-650 2.4.41/ASTM D 3386 | ppm/℃ | 215 | ppm/℃ | 215 |
| Density(Specific Gravity) | ASTM D 792 | g/cm3 | 2.25 | g/cm3 | 2.25 |
| Td(2% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 535 | ℃ | |
| Td(5% Weight Loss) | IPC-650 2.4.24.6(TGA) | ℃ | 553 | ℃ | |
| Flammability Rating | UL-94 | V-0 | V-0 | ||
Typical Applications
Leveraging ultra-low signal loss, precise dielectric control and outstanding environmental tolerance, this TLX-8 PCB serves as a reliable core component for multiple high-end RF and microwave industrial systems:
- High-precision radar systems
- Commercial mobile communication equipment
- Professional microwave test and measurement devices
- Microwave signal transmission equipment
- RF passive devices including couplers, splitters, combiners and amplifiers
- High-stability communication antenna systems
Conclusion
Engineered with Taconic TLX-8 high-performance laminate and finished with premium ENIG surface treatment, this 2-layer PCB delivers unrivaled low-Dk, low-Df and high PIM stability for microwave and RF applications. Its exceptional dimensional stability, minimal moisture absorption and strong resistance to extreme environments enable consistent performance in aerospace, marine, high-temperature and high-vibration scenarios. Fully tested electrically and certified to IPC-Class-2 standards, this PCB supports flexible customization and global delivery, catering to prototyping and batch production demands for communication, radar and microwave test projects.
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