Single Sided IPC 6012 Class 2 IMS Circuit Board Hole Dented Aluminum
Hole-dented Aluminum PCB Countersunk Hole IMS Circuit Board for Led Lighting
(PCB’s are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of single sided aluminum PCB for the application of Led Lighting with bowl-dented holes. It's at 1.6 mm thick with 1 W/MK thermal conductivity. The aluminum plate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. 25 boards are packed for shipment.
Parameter and data sheet
| PCB SIZE | 40 x 40mm=1PCS |
| BOARD TYPE | IMS PCB |
| Number of Layers | Single sided PCB |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 35um(1oz) |
| 1W/MK dielectric material | |
| Aluminum 5052 | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 10mil/12mil |
| Minimum / Maximum Holes: | 3mm /8.5mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 4 |
| Thermal resistance(°C/W) | ≤0.45 |
| Breakdown Voltage(VDC) | 4000 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Thermal conductivity | 1W/MK dielectric material, MCPCB |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless nickel over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickel) |
| Solder Mask Apply To: | Top. 12µm Minimum. |
| Solder Mask Color: | White,PSR400 WT02 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Top |
| Colour of Component Legend | Black |
| Manufacturer Name or Logo: | as per requirement |
| VIA | no via |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Features and benefits
SMT process
Effective heat dissipation reduces the operating temperature of the module and prolongs the service life.
Power density and reliability are improved up 10%.
Reduce the dependence of heat sinks and other hardware (including thermal interface materials),
Reduce the volume of the product,
Reduce the cost of hardware and assembly,
Products and Manufacturing are certified by authorized organizations.
100% tests inclusive of electrical test and AOI inspection.
High voltage test, Impedance control test, micro-section, solder-ability test,
Competitive price
On-time service
More than 18 years' experience
Applications
Electro-mechanical
Switch regulator
Communication electronic equipment
Office automation equipment
Motor controller
Get in Touch
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