Bicheng Electronics Technology Co., Ltd
                                                                                                           
Verified Supplier
23 Years
Since 2003
Menu

RO3203 Double Sided 60mil High Frequency PCB For Base Station Infrastructure

Price Negotiable
MOQ: 1PCS
Delivery Time: 8-9 working days
Brand: Bicheng
Product Description

 

Rogers RO3203 Double Sided 60mil High Frequency PCB For Base Station Infrastructure

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO3203 High Frequency Circuit Materials of Rogers Corporation are ceramic-filled laminates reinforced with woven fiberglass. This material is engineered to offer exceptional electrical performance and mechanical stability at competitive prices. The dielectric constant of RO3203 High Frequency Circuit Materials is 3.02. This, along with a dissipation factor of 0.0016, extends the useful frequency range beyond 40 GHz.

 

RO3203 laminates combine the surface smoothness of a non-woven PTFE laminate, for finer line etching tolerances, with the rigidity of a woven-glass PTFE laminate. These materials can be fabricated into printed circuit boards using

standard PTFE circuit board processing techniques. Available cladding options are 0.5, 1 or 2 oz./ft2 (17, 35, 70 micron thick) electrodeposited copper foil. These laminates are manufactured under an ISO 9002 certified quality system.

 

Features:

1. Woven glass reinforcement improves rigidity for easier handling.

2. Uniform electrical and mechanical performance is ideal for complex multilayer high frequency structures.

3. Excellent mechanical properties over a wide range of dielectric constants are ideal for multilayer board designs.

4. Excellent dimensional stability for high production yields.

5. Economically priced for volume manufacturing.

 

Typical Applications:

1. Base Station Infrastructure

2. Wireless Telecommunications Systems

 

 

PCB Capability (RO3203)

PCB Material: Ceramic-filled Laminates Reinforced with Woven Fiberglass
Designation: RO3203
Dielectric constant: 3.02±0.04
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RO3203

RO3203 Typical Value
Property RO3203 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.02±0.04 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Dissipation Factor,tanδ 0.0016 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Conductivity 0.47 (3.2)   W/mK Float 100℃ ASTM C518
Volume Resistivity 107   MΩ.cm A ASTM D257
Surface Resistivity 107   A ASTM D257
Dimensional Stability 0.08 X, Y mm/m +E2/150 after etch IPC-TM-650 2.4.3.9
Tensile Modulus   X Y kpsi RT ASTM D638
Flexural Modulus 400 300 X Y kpsi A ASTM D790
Tensile Strength 12.5 13 X Y kpsi RT ASTM D638
Flexural Strength 9 8 X Y kpsi A ASTM D790
Moisure Absorption <0.1   % D24/23 IPC-TM-650 2.6.2.1
Coefficient of Thermal Expansion 58 13 Z X,Y ppm/℃ -50 ℃to 288℃ ASTM D3386
Td 500   TGA ASTM D3850
Density 2.1   gm/cm3 23℃ ASTM D792
Copper Peel Stength 10 (1.74)   lbs/in (N/mm) After solder IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Bicheng Electronics Technology Co., Ltd
Location 6-11C Shidai Jingyuan,Fuyong, Baoan, Shenzhen, Guangdong, China 518103
Contact Person Ivy Deng

Request A Quote

Please check your email address.
Your message must be at least 20 characters.