RT5880LZ Multilayer Rogers PCB Board 10mil Double Sided
Rogers RT/duroid 5880LZ High Frequency PCB 10mil 20mil 50mil and 100mil RT5880LZ PCB
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
Rogers RT/duroid 5880LZ laminates are unique PTFE composites, which are designed for exacting stripline and microstrip circuit applications. The unique filler results in a low density, lightweight material for high performance and weight sensitive applications.
The very low dielectric constant is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness to Ku-band and above.
Features:
1. Lowest dielectric constant of 2.00 +/- 0.04
2. Low dissipation factor ranging from .0021 to .0027 at 10GHz
3. Low Z-axis coefficient of thermal expansion at 40 ppm/°C
4. Lightweight / low density of 1.4 gm/cm sq.
5. Uniform electrical properties over a wide frequency range
6. Resistant to all solvents and reagents, hot or cold, normally used in etching or plating
Some Typical Applications:
1. Airborne antenna system
2. Lightweight feed networks
3. Military radar systems
4. Missile guidance systems
5. Point-to-point digital radio antennas
Our PCB Capability (RT/duroid 5880LZ)
| PCB Material: | Unique PTFE Composites |
| Designation: | RT/Duroid 5880LZ |
| Dielectric constant: | 2 |
| Dissipation Factor | 0.0021 10GHz |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm) |
| Laminate thickness: | 10mil (0.254mm), 20mil (0.508mm), 50mil (1.270mm), 100mil (2.540mm ) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Typical Value of RT/duroid 5880LZ
| Property | Typical Value RT/duroid® 5880LZ | Direction | Units | Condition | Test Method |
| Dielectric Constant er,Process | 2.00 ± 0.04 | Z | 10 GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Dielectric Constant er,Design | 2.00 | Z | 8 GHz - 40 GHz | Differential Phase Length Method | |
| Dissipation Factor, tan | Typ: 0.0021 Max: 0.0027 | Z | 10GHz/23°C | IPC-TM-650, 2.5.5.5 | |
| Thermal Coefficient of Dielectric Constant, er | +20 | Z | ppm/°C | -50°C to 150°C 10GHz | IPC-TM-650, 2.5.5.5 |
| Volume Resistivity | 1.74 X 10^7 | Mohm•cm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Surface Resistivity | 2.08 X 10^6 | Mohm | C-96/35/90 | IPC-TM-650, 2.5.17.1 | |
| Electrical Strength | 40 | KV | D48/50 | IPC-TM-650, 2.5.6 | |
| Dimensional Stability | -0.38 | X,Y | % | IPC-TM-650, 2.4.39A | |
| Moisture Absorption | 0.31 | % | 24 hours/23°C | IPC-TM-650, 2.6.2.1 | |
| Thermal Conductivity | 0.33 | Z | W/m/°K | 80°C | ASTM C518 |
| Coefficient of Thermal Expansion | 54, 47 40 | X,Y Z | ppm/°C | 0 to 150°C | IPC-TM-650, 2.4.41 |
| Outgassing | |||||
| TML | 0.01 | % | ASTM E-595 | ||
| CVCM | 0.01 | ||||
| WVR | 0.01 | ||||
| Density | 1.4 | gm/cm^3 | ASTM D792 | ||
| Copper Peel | >4.0 | pli | IPC-TM-650, 2.4.8 | ||
| Flammability | V-O | UL 94 | |||
| Lead-Free Process Compatible | YES | ||||
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