Immersion Silver SMT PCB Assembly FR4 Tg170 Printed Circuit Board Fabrication
Price:
Negotiable
MOQ:
1000pcs
Delivery Time:
15 WORKING DAYS
Brand:
IBE
Product Description
Surface Mount PCB Assembly
Surface-mount technology (SMT) permits the creation of smaller PCB designs by allowing components to be placed closer together on the board. This means devices can be designed to be more lightweight and compact.
Our Advantages
1, PCB Making (Rigid, Flexible,Rigid-Flexible,Aluminium, High TG,Ceramic), Component Sourcing, SMT&DIP, Free Program & Test, OEM/ODM Serivce
2, Factory Area:60000㎡ Shenzhen factory; two other factories in US and Vietnam
3, Certifcation:ATF 16949,ISO 13485,ISO 14001,ISO9001,UL(E326838),Disney FAMA, CE,FCC,ROHS,
4, Quality Control:IPC-1-610E Standard,E-test,X-ray,AOI Test,IQC,QC,QA,100% Functional Test
| 1 | Material | PR4,Halogen free, High TG,CEM3,PTFE,Aluminum BT,Rogers |
| 2 | Board Thickness | Mass Production:0.3-3.5mm Samples:0.21-6.0mm |
| 3 | Surface Finish | HASL,OSP,Immersion Silver/Gold/SN,Flash Gold, Gold Finger,Hard Gold Plating |
| 4 | PCB Panel Size | Max Mass Productoin: 610x460mm Sample:762x508mm |
| 5 | Layer | Mass production:2-58 Layers, Samples:1-64 Layers |
| 6 | Min. Drill Hole Size | Laser Drill 0.1mm,Machine Drill 0.2mm |
| 7 | PCBA QC | X-ray,AOI Test,Functional Test |
| 8 | Speciality | Automotive,Medical/Gaming/Smart Device,Computer,LED/Lighting,etc |
| 9 | Sanforized | Buried via, Blind via, Mixed Pressure,Embedded Resistance,Embedded Capacitance, Local Mixed Pressure, Local High Density, Back Drill, Impedance Control |
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Company
IBE ELectronics Co.,LTD
Contact Person
Anna